Electronics Forum | Mon Oct 16 00:45:33 EDT 2000 | soza
Dear sir, I have a problem to find the new chemical solution instead IPA(isopropyl alcohol) to eliminate contamination on the test pin socket board made from copper that plate with nickle and gold. And after the often testing IC process, the co
Electronics Forum | Thu Mar 06 22:34:55 EST 2003 | davef
O' Connor: Are you saying that: * You solder fine in the areas where you print paste * You solder poorly in the areas where you don't print paste Aside from that, the gold on these pads seems to be less bright than previous lots. [if that's not it
Electronics Forum | Fri May 28 13:19:31 EDT 2021 | cbart
I can't see the image very well, but from what i see it looks like oxidation. looks like an ENIG finish on the board, possibly a plating issue from the bare board house, thin gold or the nickle is to thick. one other question i would get an answer t
Electronics Forum | Wed Jul 28 20:56:58 EDT 1999 | Dave F
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Mon Nov 26 17:42:24 EST 2001 | davef
I agree. Voids in plating are bad news and baking will not change that.
Electronics Forum | Tue Jan 07 17:33:26 EST 2020 | SMTA-Norah
Were the boards baked out before soldering? Is there plated over vias in the pads?
Electronics Forum | Wed Apr 04 17:40:39 EDT 2007 | davef
Rob: How do you rework blow-holes and pin-holes? PTH plating thickness SB 1 thou or greater. Epoxy is hydroscopic. So, you should control the environment and/or bake the moisture from the boards before soldering. Search the fine SMTnet Archives f
Electronics Forum | Mon Dec 31 09:00:06 EST 2001 | davef
Baking before assembly does nothing good. It: * Increases costs. * Adds steps to the process and makes scheduling more cumbersome. * Increases the amount corrosion on solderable surfaces. We used to bake to remove the moisture from boards that caus
Electronics Forum | Tue Mar 11 13:42:07 EST 2003 | MA/NY DDave
Hi As I got thinking about your problem, as you stated it, I am wondering if maybe we have some oxides or too thin of a Gold Immersion layer so that some of the underlying NI is being oxidized. The colorization that you described is what intriques m
Electronics Forum | Wed Sep 09 08:25:40 EDT 2009 | davef
We understand that you have boards in production that you need to ship. In the future, you could eliminate your moisture caused blow hole issue a lot more simply than baking. Consider requiring that your board fab plate the copper thickness of throug
