Electronics Forum | Fri Mar 07 15:07:50 EST 2003 | davef
YiEng, MA/NY DDave: Usually when the gold plating bath goes south, you loose solderability.
Electronics Forum | Fri Jan 21 13:29:35 EST 2005 | vinod
Hi Friends, I had a PCB with polymide material with nickle tin plating on it. I had real hard time to do hand solder. I am asking help if any one have any experience with polymide material.
Electronics Forum | Mon Feb 27 06:42:37 EST 2006 | Slaine
What are the long term issues with high tin content solders on parts plated with silver over copper? Is it possible that the silver will be absorbed by the solder then over a long period of time the tin will react with the copper causing it to part
Electronics Forum | Mon Dec 13 10:12:45 EST 1999 | John Thorup
Hi Dennis The gold plating on a circuit board is present to protect the nickle plating from corrosion. The layer is so thin that as it goes into solution in the solder it constitutes only a small percentage of the total joint. It is commonly accept
Electronics Forum | Mon Jun 25 20:39:08 EDT 2001 | ianchan
Hi mate, no complete info given from what i see, so just some humble comments, mayhaps you review : 1) PCB pad finishing - Copper+nickle plated? coz if so, nickle is a KILLER to good solder wetting. what we did back here, was to HAL coat the nickle
Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup
Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the
Electronics Forum | Tue Dec 14 15:21:41 EST 1999 | BJL
This may be the nickle paladium lead material or an 87/13 tin lead plating on the leads. Paladium and 87/13 has a slower disolution rate and takes longer for solid joint to be created between two metal surfaces. Reflow temp must allow the joint to be
Electronics Forum | Sat Jul 05 07:30:04 EDT 2003 | AlCapone
If the problem as you described as the gold plating contaminated, and the Nickel layer exposed to the solder pot. However, the purpose of the gold layer is to protect the nickel and copper layer not turn into corrosion and resist to other issue (humi
Electronics Forum | Mon Nov 19 17:40:38 EST 2007 | bbarton
No, the thicker plating and need for very high quality drilling and plating is DUE to the higher copper dissolution rate and higher contact time. As to the Sn100C material, their claims seem to confirm a "lower" copper dissolution rate, but so does A
Electronics Forum | Fri Jun 03 15:19:32 EDT 2022 | dwl
I don't recall thicknesses off the top of my head but brittleness becomes an issue more for gold plating then ENIG. .125 um should be fine. also, gold ain't cheap so its unlikely your PCB fab will get anywhere near the max tolerance. On the other e
