Used SMT Equipment | Soldering - Reflow
ERSA Powerflow, vintage 2008, NEW Unused!! Options: Dynamic heating module Wave nozzle SMD 400mm typ ERSA PowerWave, lead free Control & monitoring of dynamic heating module Solder frames 500mm - 5pcs Side bars (2 pcs.) 500mm for solder frames
Used SMT Equipment | Repair/Rework
The Conceptronic Freedom 3000 printed circuit board repair station is designed for component rework, low volume prototype reflow soldering and process development. The Freedom 3000 machine structure is accurate, rigid, and stable in order to repeated
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
Industry News | 2018-10-18 09:06:41.0
Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors
Industry Directory | Manufacturer
Electronic PCB design, fabrication, and assembly for both plated through hole and SMT
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Screen Printing, Placement, and Reflow; all are Surface Mount Technology processes which present demands that can benefit from the use of specialized SMT fixtures and tooling. And if you are working with flex circuitry, your process requires it. Tak
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Technical Library | 2019-05-15 22:26:02.0
As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.
