Electronics Forum | Mon Apr 29 03:16:43 EDT 2002 | Bob Willis
I have only seem problems so I would suggest you don't do it.
Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band
I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi
Electronics Forum | Fri Oct 29 10:02:28 EDT 1999 | John Thorup
Chris A lot of people have reported sudden, fab lot related problems with Ni/Au pads. These are usually characterized by a discoloration of the gold and called cheerful names like "black pad disease". This can be a process problem at your fab house
Electronics Forum | Thu Apr 18 16:52:15 EDT 2002 | davef
General comments are: * First place I would look is the supplier of the pins that you are trying to install. Most suppliers that sell press fit components have done a good deal of work to qualify the component and will have all the specifications yo
Electronics Forum | Mon Feb 19 15:32:42 EST 2007 | blnorman
We use SnPb paste and bar with leaded and non-leaded component finishes. The predominant finish on components we use is Tin, there are a few NiPdAu. We've had no problems with the component finishes used in the SnPb process.
Electronics Forum | Tue Apr 04 12:44:08 EDT 2006 | Andrew
Anyone knows if there are some issues when you solder Silver finish components on Ni-Au finish pads with Sn/Pb/Ag solder paste (Indium)? (I must use components with silver finish) Thanks
Electronics Forum | Tue Apr 03 11:08:21 EDT 2001 | vsorin
Hi, Our engineering board has to decide which technology is better for the hand soldering of the SMT components: HASL or Chemical Ni-Au. We have an automatic line for SMD assembling and our experience shows us that for this automatic line is better
Electronics Forum | Wed Apr 05 20:52:51 EDT 2006 | davef
If you let the silver content of your solder connections get much above 3 percent, it could cause reliabilitility problems, similar to the problems caused when the gold content gets too high.
Electronics Forum | Thu Apr 13 07:18:47 EDT 2006 | Charles
It will be hard to solder metal that finish by any coating. So you should remove the coating first. You need strong acid to remove coating. After you solder both then you can silder finish esay.
Electronics Forum | Tue Apr 03 22:03:18 EDT 2001 | davef
With friends like you, who needs enemies? I�d guess that the perceived benefits of flat pads for your 20 mil pitch and below components counter-balance the higher cost, gold being a solder pot contaminant, limited solder mask compatibility, potentia
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