Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Thu Sep 18 23:56:56 EDT 2008 | trynders
am having wetting issues with two Burr Brown Op amps. Both are SOICs with NiPdAu lead frame finishes. I have attached a photo that shows a black streak the length of the lead (before soldering). This appearance is consistent of all leads and is exist
Industry News | 2014-02-03 14:13:04.0
FCT Assembly is pleased to announce that it now offers a variety of anti-tombstoning solder pastes as an option with each of its solder paste fluxes.
Industry News | 2010-03-22 13:59:02.0
GREELEY, CO — FCT Assembly introduces its NL932 no-clean, lead-free, halide-free solder paste. The paste features excellent solderability, enabling the process to handle the most difficult wetting requirements.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
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