Electronics Forum | Thu Oct 05 11:40:49 EDT 2006 | Mario Scalzo, SMT CPE
David, We have seeing this more and more in the recent weeks. In a nut shell, yes; we believe that the voids that you are seeing are from the trapped air in the via from printing over it. If you could remove the Kapton tape, this might help. Also
Electronics Forum | Sun Aug 29 19:17:34 EDT 2004 | aqueous
Chen, It is always best to place one�s effort on determining the cause and content of the residue rather than trying to work around it. The first thing you must determine is the nature of the residue. Is it flux? In many instances, the residue is
Electronics Forum | Thu Feb 13 03:49:15 EST 2014 | jlawson
Yes all above is correct, as solder deposits get smaller and mesh T4+ , actual metal to air contact surface area increases , say in contrast to T3, add to this less flux , and flux running away from the joint, re-oxidation and what flux is left, can
Electronics Forum | Tue Oct 12 15:20:44 EDT 1999 | Jim Schultz
I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).
Electronics Forum | Tue Mar 15 09:46:06 EST 2005 | davef
Comments are: * J-STD-001 and A-610 committees have eliminated the requirement that solder joints be "bright and shiny". Certain metallizations (such as gold) can influence the solder joint surface texture, but have no impact of reliability. Reliance
Electronics Forum | Fri Jun 02 17:33:51 EDT 2000 | Dave F
Hey CK, we�re all sodder googoo�s ... wanna be gurus Why donchu tell �em not to put sodder in your vias? Er, makit so the sodder won�t flow out of the bottom of the vias and cause dem stalactites? OK OK, here�s wacha do, modify the second side ste
Electronics Forum | Thu Jul 25 12:25:54 EDT 2019 | davef
In “J-STD-001 Rev G Amendment 1 Process Qualification” Debbie Carboni, Global Product Line Manager, KYZEN Corp, Nashville, TN said: What change constitutes a need for requalification? Major/ Level 1 – Flux or flux-bearing materials (e.g. flux, so
Electronics Forum | Sun May 23 15:12:59 EDT 1999 | JohnW
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Fri May 15 14:41:25 EDT 1998 | Terry Burnette 512-933-5783
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Tue Aug 13 17:34:44 EDT 2002 | pjc
The Electra is Electrovert's top-of-the-line wave solder machine. Just about the best you could get. Conveyor concerns should focus on the condition of the extruded rails. A machine that new should not have a problem, buy worth a look see. Find out i
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