Electronics Forum | Wed May 12 20:43:53 EDT 1999 | Earl Moon
| Folks, | I am interested in knowing what level of Nitrogen purity you are running in your reflow ovens for standard SMT assembly? | It seems over the last several years people are increasing the Oxygen level in thier reflow oven atmosphere. | What
Electronics Forum | Fri Sep 07 08:57:28 EDT 2001 | Hussman
Por, You talking wave solder or reflow solder? At wave, nitrogen is the way to go. Just like you stated, it does affect the surface tension. If you're reflowing, I wouldn't go nitrogen unless you have to. Improper stencil design is usually the c
Electronics Forum | Mon Aug 13 10:00:18 EDT 2007 | ed_faranda
Might want to check to see if the weight of your part has increased. If it has increased, you may not have enough surface tension to hold the part on the board. I am assuming you already checked that the component isn't getting hit by something in
Electronics Forum | Wed May 12 13:34:02 EDT 2010 | hegemon
Thanks Pete B - great info. I am currently preparing a DOE to address concerns about reflow of componentry on the bottomside of the PCB while in the vapor. Specifically cosmetics and part dropping. Bottom side has no flux, but will be fully reflow
Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc
Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can
Electronics Forum | Thu Feb 17 21:45:26 EST 2000 | Dave F
Steve: Wadja mean "I fixed it, now tell me what I did to fix it." Steve, you�re one scary guy. ;-) "Steve�s Longer Pad Theory" - Stubby pads will not make solder flow-up the leads of a QFP100, leaving sparse solder on the pads. Given a choice, s
Electronics Forum | Thu Feb 17 21:45:26 EST 2000 | Dave F
Steve: Wadja mean "I fixed it, now tell me what I did to fix it." Steve, you�re one scary guy. ;-) "Steve�s Longer Pad Theory" - Stubby pads will not make solder flow-up the leads of a QFP100, leaving sparse solder on the pads. Given a choice, s
Electronics Forum | Mon Aug 16 16:57:06 EDT 2004 | Shean Dalton
Try to observe the board as it exits the wave, look for solder snapping as the leads finally exit the solder. The surface tension could be such that a "string" of solder stretches away from the wave until it finally breaks. Then, as the string reco
Electronics Forum | Fri Apr 10 20:35:59 EDT 1998 | Steve Gregory
| | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. T
Electronics Forum | Mon Apr 13 08:42:32 EDT 1998 | Bob Silveri
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
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