Electronics Forum | Wed Apr 23 15:17:11 EDT 2003 | Robert
Let me see if I got this right. The OSP in un-plugged vias will break down after subsequent reflows and washes which can result in oxidation. Question: Is there any paper covering oxidation and reliability on such a condition. We are averaging .0007
Electronics Forum | Tue Apr 22 14:53:22 EDT 2003 | Robert
OK...I'm hooked on this subject. Were changing from NiAu to OSP as a "savings" and not because we choose too. So far we have had great success with BGA and are working on TSOP, SOP, etc. The only thing we have come to dislike so far is the ring aroun
Electronics Forum | Wed Apr 23 16:01:45 EDT 2003 | davef
Question: Is there any paper covering oxidation and reliability on such a condition? Answer: Dunno, what does the 'sales-type' that talked you into this say?
Electronics Forum | Thu Apr 24 07:43:00 EDT 2003 | caldon
Contact ACI where they have done tons of research on this. 610-362-1200...ask for Chris Theirolf. www.aci-usa.org cal
Electronics Forum | Fri Jun 01 12:23:22 EDT 2001 | medernach
I've had good and bad experiences with OSP's. First of all, ask yourself, "Why use an OSP?" If you don't need it, don't use it. Solderability is dependent upon the number of thermal passes (the fewer, the better), the thickness of the coating, the
Electronics Forum | Tue Jun 05 21:14:10 EDT 2001 | davef
You aren't going to post our stuff on your "Hey, I'm the wizard site", are you? Board fab, Pad coatings, OSP 1 OSPs: Imidazole (Via Systems) is good. Entek (Enthone) works, but requires strict thickness control in fab. 2 Enthone CU56 allows one t
Electronics Forum | Thu Jun 14 21:20:23 EDT 2001 | davef
Aw, don't be such a baby!!! ;-) It's a blank of a lot cheaper than ENIG. Costs about the same as HASL, maybe even cheaper. Why not have your fab build-up a split a lot [er, maybe build a few extra, whatever.] next time you order your "favorite" b
Electronics Forum | Wed Apr 26 03:32:29 EDT 2006 | saaitk
Hi all, Has anyone any experience they can share with regard to pad dissolution on PTH's on thick boards. We are using lead free SAC305 on both OSP and Immersion silver finishes and are experiencing difficulties when removing and replacing connector
Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
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