Industry News | 2012-06-28 21:14:17.0
Seika Machinery, Incannounces a special sale to assist its customers with meeting the IPC 1601 PCB Storage and Handling Guideline. Effective June 25-July 27, 2012, Seika Machinery is offering a special discount on McDry MC-1001 and MC-1002 PCB Storage Cabinets.
Industry News | 2015-11-04 19:54:09.0
Seika Machinery is pleased to announce a special sale, effective immediately. Seika is offering significant savings on its McDry Ultra-Low Humidity Storage Cabinets while supplies last. All inventory McDry cabinets will be quoted with extra year-end discounts.
Industry News | 2012-06-25 12:38:27.0
Seika Machinery, Inc. announces a special sale to assist its customers with meeting the IPC 1601 PCB Storage and Handling Guideline
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
Electronics Forum | Fri Jun 01 01:07:13 EDT 2001 | Brian Sloth Bentzen
I would be very interested in informations on OSP (organic solderability protection) on PCB�s. Good or bad experience with solderability, storage etc. There must be different types / brands of OSP. What type should be prefered ? And if possible
Electronics Forum | Thu Jun 14 13:41:06 EDT 2001 | bentzen
Thanks a lot Dave. I think I will stay away from OSP. I just thought that it could be a cheaper solution than NiAU for fine pitch. And I don�t trust the silver coating types. Brian
Electronics Forum | Wed Jun 06 10:51:11 EDT 2001 | genny
Since you brought it up, Dave, I did check your math. Looks good to me! :-)
Electronics Forum | Wed Apr 23 08:35:54 EDT 2003 | davef
Over time, copper in the via will form an oxide with oxygen in the air.
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
