Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Technical Library | 2019-07-02 23:02:05.0
The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. As a result, more frequent maintenance of the filtration systems is required and machine downtime is increased.Last year a different method of cleaning reflow ovens was introduced. Instead of cooling down the process gasses to condensate the residues, a catalyst was used to maintain the clean oven. Catalytic thermal oxidation of residues in the nitrogen atmosphere resulted in cleaner heating zones. The residues were transformed into carbon dioxide. This remaining small amount of char was collected in the catalyst. In air ovens the catalyst was not seen as a beneficial option because the air extracted out of the oven was immediately exhausted into the environment. When a catalyst is used in an air environment there is not only the carbon dioxide residues, but also water. When a catalyst is used in an air reflow oven the question is where the water is going to. Will it condensate in the process part of the oven or is the gas temperature high enough to keep it out of the process area? A major benefit of using a catalyst to clean the air before it is exhausted into the environment is that the air pollution is reduced dramatically. This will make environmental engineers happy and result in less pollution of our nature. Apart from this, the exhaust tubes remain clean which reduces the maintenance of air ovens.This paper will give more detailed information of catalyst systems during development and performance in production lines.
Industry News | 2014-08-12 19:17:07.0
SEHO North America will hold its 2014 Technology Days in conjunction with Stannol GmbH, Germany. SEHO technology days are based on a simple principle: to provide a perfect balance of theory and practical application. During the two-day event, leading flux, solder and equipment suppliers will provide their expert insight on all relevant process subjects.
Industry News | 2014-09-29 16:55:03.0
SEHO North America, Inc. announced that it will hold its 2014 Technology Days in conjunction with Stannol GmbH, Germany.
Industry News | 2015-02-04 17:49:57.0
Vi TECHNOLOGY will participate in the PCB manufacturing processes workshop, scheduled to take place April 21-23, 2015 at the Kintner Equipment Corp. facility in Endicott, New York. ACE Production Technologies, Inc. has partnered with Kintner Equipment Corp. to conduct the free workshop.
Industry News | 2013-12-02 17:30:32.0
Computrol, Inc. has placed an order for its third KISS 103 Selective Solder System from ACE Production at its manufacturing facility in Meridian, Idaho.
Industry News | 2021-10-11 16:00:11.0
SEHO Systems GmbH ensures more productivity in electronics production with flexible and innovative concepts. At productronica 2021, SEHO will focus on new solutions in hall A4, stand 578, which implement cost-efficient high-mix-high-volume production and further improve production processes.
Industry News | 2013-07-16 14:26:29.0
SEHO North America, Inc. announces that it has extended the upcoming Selective Soldering Seminar from the SEHO Academy with a ‘Reflow Day.’
Industry News | 2017-12-14 16:24:03.0
Kurtz Ersa North America today announced that it will hold a two-day ERSA Versaflow 3 Selective Soldering Level II Maintenance Training Course from Monday, January 15, 2018 at 1 p.m. to Wednesday, January 17, 2018 at 12 p.m. at the Kurtz Ersa Mexico office in Guadalajara. This course will provide the knowledge and hands-on experience required to maintain and troubleshoot issues on the Versaflow 3 machines.
