Industry News | 2020-07-22 04:54:01.0
Indium Corporation's Brian O'Leary, Global Accounts Manager, will partner with KYZEN's Debbie Carboni, Global Product Line Manager, Electronics, to present an InSIDER Series webinar on cleaning no-cleans. There will be two sessions of the webinar--Tuesday, August 4 at 11 a.m. Eastern Time (4 p.m. British Time/11 p.m. Malaysia Time) and Wednesday, August 5 at 5:30 a.m. Eastern Time (10 a.m. British Time/5:30 p.m. Malaysia Time).
Industry News | 2014-10-23 15:20:42.0
MicroCare Corp. unveiled today the new and improved TidyPen® ‘60-second sticky stuff remover’. With thousands of the pocket-sized TidyPen® label removers sold monthly, the TidyPen® tool is a must-have time-saver for electronics manufacturing, repair shops, medical facilities, classrooms and any other place sticky labels are used.
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
Technical Library | 2017-02-09 17:08:44.0
The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
Industry News | 2010-02-25 23:20:41.0
RANCHO CUCAMONGA, CA — February 2010 — Aqueous Technologies Corporation is heading for a new industry record with the winning of an ambitious 32 prestigious awards across their portfolio of innovative defluxing and stencil cleaning systems and cleanliness testers.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-10-09 18:31:30.0
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2021-10-11 16:00:11.0
SEHO Systems GmbH ensures more productivity in electronics production with flexible and innovative concepts. At productronica 2021, SEHO will focus on new solutions in hall A4, stand 578, which implement cost-efficient high-mix-high-volume production and further improve production processes.
