Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Used SMT Equipment | Soldering - Selective
Hot Bar Soldering Flex Circuit to PCB Ribbon Cable to PCB Coaxial Cables Fine Pitch SM Devices Edge Connectors to PCB Thermocompression Bonding Tab to PCB, HSC to LCD or tab More information pjbril@smtunion.com m.madera@smtunion.com W
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Used SMT Equipment | Soldering - Selective
Thermode Length 100mm, Stroke 50mm, Flex Bond 1/2inch Force 10 to 100N @ Bar Preheat/Reflow 0-200 Seconds Work Area 260X200mm Temp Range 25 to 400c in 1 degree Intervals Voltage 110/220 CCD Camera System with Monitor Condi
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Industry News | 2017-02-02 10:26:34.0
Nordson ASYMTEK, a Nordson company will exhibit its latest and most popular technologies for fluid dispensing, jetting, conformal coating, and hot bar soldering in booth 1611 at the IPC APEX tradeshow, in San Diego, California, being held February 14-16, 2017. ASYMTEK is joining its sister Nordson companies to support IPC as it celebrates its 60th year in the electronics manufacturing industry.
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