Full Site - : no solder bonding (Page 6 of 118)

Circuit Trace Repair Kit

Circuit Trace Repair Kit

New Equipment | Rework & Repair Equipment

The BEST PCB circuit trace repair kit gives you the tools you need for fast modification and repair of PCB circuit traces. Our online PCB repair training videos, our master instructors along with these materials allows you to meet the original PCB qu

BEST Inc.

BEST Appoints Japanese Distributor for PCBV Rework/Repair Products

Industry News | 2009-07-22 10:45:59.0

BEST Appoints Japanese Distributor

BEST Inc.

Customized Circuit Frames for PCB Repair

Industry News | 2009-10-17 09:43:47.0

Reduce PCB Repair Costs

BEST Inc.

S-Bond Technologies

Industry Directory | Manufacturer

Brazing and soldering, metal bonding, dissimilar materials, active solder technology

Mechanical stress test for component solder joints and bonding wires

Technical Library | 2016-08-24 06:15:35.0

From consumer electronics to systems control, automotive technology to aviation and aerospace – today, electronics are absolutely essential in many sectors. They increasingly replace mechanical components, eliminating wear and tear and thereby extending the service life. What is easily forgotten in this regard is that electronics are also subject to the laws of mechanics. Mechanical test equipment is crucial to test components for the secure hold of welded, soldered or adhesive bonds. A new, mechanically intricate test probe with universal clamping jaws, that can even grasp the individual bonding wires, is in line with the trend toward ever smaller components. Serving as an actuator for these is a micro drive that can be precisely controlled using a miniaturised motion controller to relieve the control unit in the test device.

XYZTEC bv

SIPLACE Stationwise Download Seamless setup changeovers with no downtime

Industry News | 2012-07-17 11:30:16.0

Being able to change setups on the line quickly and efficiently is especially important in modern electronics production environments with their many products and frequent product changeovers, because it improves your productivity and generates additional cost savings.

ASM Assembly Systems GmbH & Co. KG

Thermosonic bonding of flip chip - Finetech bonder

Thermosonic bonding of flip chip - Finetech bonder

Videos

Flip Chip Thermosonic Bonding with the FINEPLACER® pico MA. http://eu.finetech.de/micro-assembly/products/fineplacerr-pico-ma.html More information about Thermosonic bonding: http://eu.finetech.de/micro-assembly/technologies/ultrasonic-thermosonic-b

Finetech

Nordson DIMA introduces new inline concept for hot bar bonding and soldering at Productronica 2017

Industry News | 2017-11-08 15:24:31.0

Nordson DIMA, a division of Nordson Corporation (Nasdaq NDSN), will exhibit a range of products at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, on November 14-17, 2017, in Hall A2, stands 345 and 578.

C-Tech Systems, B.V. [formerly Nordson DIMA]

New SN100CV solder paste from Nihon Superior at SMTAI reduces voiding

Industry News | 2018-09-18 20:11:02.0

Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Co., Ltd.

An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications

Technical Library | 2013-01-24 19:16:35.0

The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.

Christopher Associates Inc.


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