Full Site - : no solder fillets (Page 3 of 77)

Marantz M22XDL460 AOI System

Marantz M22XDL460 AOI System

Used SMT Equipment | AOI / Automated Optical Inspection

Offered systems: 2 x Configurations, consisted from: M22XDL460 AOI ,Power Mac G5 PC, Monitor 17” Vantage: 2006 Condition: good. Marantz Aoi Systems •Automatic Optical Inspection of PCB’s •Inspects: SMT & THT Components (presence, type, polari

Fix Trade BV

TR7500QE - 3D Automated Optical Inspection System

Videos

The TR7500QE AOI offers high performance 3D solder and assembly inspection by combining the next generation multi-angle 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection and 4 side view cameras. Latest inspection softwa

TRI - Test Research, Inc. USA

TR7700QE 3D Automated Optical Inspection Solution

Videos

The TR7700QE AOI offers high performance 3D solder and assembly inspection by combining the next generation 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection. Latest inspection software ensures quick CAD-based programmi

TRI - Test Research, Inc. USA

IPC-A-610 Certified IPC Trainer (CIT) Course

Training Courses | | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

Circuit Technology Inc.

IPC-A-610 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

Verion Training Systems, LLC

IPC-A-610 Trainer (CIT) Recertification Course

Training Courses | | | IPC-A-610 Trainer (CIT) Recert.

The Certified IPC-A-610 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-A-610 Specialist (CIS) training.

Verion Training Systems, LLC

Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction

Technical Library | 2018-09-26 20:33:26.0

Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.

AIM Solder

Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting

Technical Library | 2015-05-28 17:34:48.0

The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.

Panasonic Factory Solutions Company of America (PFSA)

Saki BF-Frontier II

Saki BF-Frontier II

Used SMT Equipment | AOI / Automated Optical Inspection

2010 SAKI BF-Frontier II AOI 100% Operational / Tested 18μm and scanning line color CCD camera Board size 2x2.4in. to 18x20 in. Inspection of (presence/absence, misalignment, tombstoning, reverse polarity, bridging, foreign material,

G-Force Technical, Ltd.

Manncorp Sherlock 300 Benchtop AOI

Manncorp Sherlock 300 Benchtop AOI

Used SMT Equipment | AOI / Automated Optical Inspection

This AOI was purchased for $49,995 from Manncorp.  The Sherlock AOI is in excellent condition and has under 200 hours of usage.   The Sherlock AOI Systems detect a comprehensive range of defects and errors in PCB assembly using the Sherlock PCB ins

Nelson Specialties Company


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Circuit Board, PCB Assembly & electronics manufacturing service provider

We offer SMT Nozzles, feeders and spare parts globally. Find out more
Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
SMT Machines

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

Training online, at your facility, or at one of our worldwide training centers"
Assembly Automation Technology

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...