Industry News | 2008-03-12 16:35:20.0
GREELEY, CO � March 2008 � FCT Solder, a division of FCT Assembly, announces that it will introduce NC162 SN100C� No-Clean Flux in booth 243 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008 in Las Vegas.
Industry News | 2009-05-01 01:10:48.0
ITASCA, IL � April 2009 � Kester announces that its FL250D no-clean solder paste has been added to the global approved materials list of a leading network equipment company due to its excellent properties in terms of eliminating/preventing head-in-pillow defects.
Industry News | 2009-07-16 14:35:03.0
POWAY, CA — July 2009 — EasySpheres LLC features Kester’s 959T no-clean, non-corrosive, halide-free Flux Pen®.
Industry News | 2016-02-11 13:36:43.0
Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.
Industry News | 2016-04-06 12:15:05.0
Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany.
Industry News | 2016-04-12 13:29:35.0
Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.
Industry News | 2017-04-04 17:11:23.0
Kester will be exhibiting (booth # 4-533), at SMT Hybrid Packaging 2017, which will take place May 16-18 at the Exhibition Centre in Nuremberg, Germany.
Industry News | 2018-09-26 11:50:32.0
SHENMAO America, Inc. is pleased to introduce its SMF-UL51, which is a no-clean, halogen-free, ultra-low-residue spray flux. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.
Industry News | 2023-05-22 18:45:34.0
SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.
6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed to provide a fast flow, lower-temperature cure for high-
