SOLDERITE ULF-210RN, ULF-210RNI, ULF-250, ULF-300VZ-3, and ULF-500VS are ultra low residue type flux and these are developed for soldering printed circuit board mounted chip componenets and flat ICs which are for miniaturize and high density purpose.
New Equipment | Solder Materials
Made for high speed leaded assembly. No Clean Solder Paste, Alloy: Sn63/Pb37, Type 3 Powder -325+500, 250 gram jar. Buy one or two jars on line. While supplies last.
Events Calendar | Mon Oct 07 00:00:00 EDT 2019 - Tue Oct 08 00:00:00 EDT 2019 | ,
PCBA Cleanliness End-of-Project Webinar
Technical Library | 2010-11-04 19:56:25.0
Conductive Adhesives represent an intrinsically clean, simple and logical solution for a myriad of electrical interconnect challenges. Adhesives not only provide a "lead-free", "no clean" alternative to solder, these highly compatible materials offer viab
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
Used SMT Equipment | Soldering - Selective
ACE KISS-103 Selective Soldering Unit (2011)Brand: ACEModel: KISS-103Year: 2011Lead-free process (titanium solderpot)Topside Preheat with pyrometer controlsDrop Jet precision flux applicator (for no-clean processing)220 VAC, 50/60 Hz, 8 amp, Single p
Used SMT Equipment | Soldering - Selective
ACE KISS-103 Selective Soldering Unit (2011)Brand: ACEModel: KISS-103Year: 2011Lead-free process (titanium solderpot)Topside Preheat with pyrometer controlsDrop Jet precision flux applicator (for no-clean processing)220 VAC, 50/60 Hz, 8 amp, Single p
Used SMT Equipment | Soldering - Selective
RPS Rhythm SS Selective Soldering System In-Line Conveyor, L to R Board Flow Leaded and Lead Free Pots Drop Jet Fluxer (no clean flux) Spray Fluxer (water wash) Nitrogen SMEMA 208V Fully Functional FOB: Origin Contact Assured Technical Ser
Used SMT Equipment | Soldering - Selective
In-Line Conveyor, L to R Board Flow Leaded and Lead Free Pots Drop Jet Fluxer (no clean flux) Spray Fluxer (water wash) Nitrogen SMEMA 208V Fully Functional FOB: Origin Contact Assured Technical Service LLC AssuredTechnicalServiceLLC@Gmail
Technical Library | 2017-08-17 12:23:27.0
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.
