Full Site - : no-clean flux (Page 7 of 145)

Tacky Assembly Flux

Tacky Assembly Flux

New Equipment |  

Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and

Hallway International Trading Co.,Ltd.

MicroCare Addresses PCB Cleaning with New Products at SMTAi

Industry News | 2018-09-23 09:54:24.0

The industry’s leading manufacturer of critical cleaning, coating and lubrication products, MicroCare Corp. has extended its portfolio even further with the launch of new and progressive products which will be showcased at this year’s SMTA International in Chicago, Illinois, USA from 14 – 18th October, which includes a new series of flux remover pens.

MicroCare Corporation

Reduced Oxide Soldering Activation (ROSA)

Technical Library | 2007-07-19 15:15:11.0

ROSA is a surface restoration technique that removes hard to reduce species like metal oxides or sulfides. At the time of its development, the focus was on solderability and compliance to environmental regulations. Industry trends and regulatory changes as a result of the Montreal Protocol were the driver for much of the concern over environmental compliance. The result was an increase in the development of no-clean and water soluble fluxes and the removal of halogenated cleaning chemistries.

Electronics Manufacturing Productivity Facility (EMPF)

Services

Services

New Equipment |  

Printed Circuit Board Assembly Services Through-Hole Our wave soldering and hand soldering processes are fully compliant with the highest commercial (IPC-A-610D) and military specifications. Surface Mount We use automated screen printing and pick-

Itronics

MicroCare Unveils New Flux Remover Packaging at IPC APEX 2018

Industry News | 2018-03-01 19:44:00.0

MicroCare Corp. stunned the PCB cleaning industry with a flurry of innovation at the massive IPC APEX EXPO in San Diego, CA this week with the launch of ten new cleaning products. Featured among these developments are popular flux-cleaning chemistries in a new, super-convenient, pocket-sized cleaning pen package. The new range features three formulations: the No-Clean Flux Remover, the RMA Flux Remover, and the Water-Soluble Flux Remover Pens. These three new cleaners have been designed to specifically remove fluxes quickly and safely and ensure PCBs will enjoy a long and productive life at the lowest possible cost.

MicroCare Corporation

Indium Corporation's Lim to Present at SEMICON China

Industry News | 2016-03-03 10:33:15.0

Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim's presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.

Indium Corporation

MULTICORE Solder Pastes

MULTICORE Solder Pastes

New Equipment | Solder Materials

As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr

Henkel Electronic Materials

FCT Solder to Premier NC162 SN100C No-Clean Flux at APEX 2008

Industry News | 2008-03-12 16:35:20.0

GREELEY, CO � March 2008 � FCT Solder, a division of FCT Assembly, announces that it will introduce NC162 SN100C� No-Clean Flux in booth 243 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008 in Las Vegas.

FCT ASSEMBLY, INC.

FCT Solder Introduces NC162 SN100C No-Clean Flux to the Electronics Industry

Industry News | 2008-02-11 15:49:48.0

GREELEY, CO � February 8, 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.�s SN100C product line, announces the NC162 SN100C� No-Clean Flux.

FCT ASSEMBLY, INC.

YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA

Industry News | 2023-06-22 15:16:57.0

YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed to provide a fast flow, lower-temperature cure for high-throughput applications and is 100% compatible with all no-clean flux residue. Additionally, it is reworkable, making it an ideal solution for manufacturers looking to reduce costs and improve production efficiency.

YINCAE Advanced Materials, LLC.


no-clean flux searches for Companies, Equipment, Machines, Suppliers & Information

Online Equipment Auction of Altronic: Small-Batch Surface Mount & Assembly Facility

High Precision Fluid Dispensers
Conductive Adhesive & Non-Conductive Adhesive Dispensing

High Throughput Reflow Oven
PCB Handling with CE

World's Best Reflow Oven Customizable for Unique Applications
Baja Bid Auction JUL 9-10, 2024

Reflow Soldering 101 Training Course