Industry News | 2024-02-12 13:43:22.0
SHENMAO Technology is pleased to announce the availability of its latest innovation, the SMF-D61 Low Residue No-Clean Flip Chip Flux. This advanced flux is meticulously engineered to meet the demanding requirements of flip chip dipping applications, offering exceptional performance and reliability throughout the soldering process.
Industry News | 2024-05-13 10:19:11.0
SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.
Industry News | 2014-05-05 16:18:13.0
Kyzen announces plans to exhibit CYBERSOLV® C8882 at the SMTA Atlanta 18th Annual Expo & Tech Forum, scheduled to take place Wednesday, May 7, 2014 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2008-08-04 13:01:17.0
GREELEY, CO � August 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it will display SLIC� Paste in booth 125 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando, FL.
Industry News | 2009-02-11 23:36:26.0
RANCHO CUCAMONGA, CA � February 2009 � Aqueous Technologies Corp. announces the StencilWasher MP, a fully automatic misprint and stencil cleaning system that is designed to remove non-reflowed solder paste and adhesives from misprinted assemblies, stencils, and screens, as well as post-reflow circuit assemblies.
Industry News | 2017-09-12 20:15:18.0
SHENMAO Technology introduces New Generation Lead-free Solder Paste PF606-P140. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues and can easily fit into highly complicated PCB designs through excellent convergence performance.
Industry News | 2017-11-24 20:19:27.0
SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 to solve HoP issues and improve ICT Testability at SMTA Exhibition: November 29, 2017 booth # 22, 9 am to 3 pm Bestronics Facility, 2243 Lundy Ave, San Jose, CA 95131
Industry News | 2017-11-28 09:32:15.0
SHENMAO Technology introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.
Industry News | 2017-11-28 19:46:04.0
SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.
Industry News | 2018-06-17 16:55:59.0
SHENMAO America, Inc. is pleased to introduce its PQ10 Low Temperature Solder Paste. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.
