Full Site - : no-clean or water soluble (Page 21 of 50)

KYZEN to Show New Fast-Acting IPA Alternative for Stencil Cleaning at NEPCON S China

Industry News | 2016-07-26 18:16:04.0

KYZEN announced plans to reveal new research findings in Stand 1P01 at NEPCON South China, scheduled to take place Aug. 30- Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared during the event.

KYZEN Corporation

Aqueous Technologies to Feature Product Literature for all Aqueous Products at SMTA Houston 2009

Industry News | 2009-04-23 20:45:14.0

Rancho Cucamonga, CA - April 2009 � Aqueous Technologies Corp. announces that the company will have a tabletop booth with literature on all Aqueous products at the upcoming SMTA Houston Expo & Tech Forum, scheduled to take place Thursday, May 28, 2009 at the Sam Houston Race Park in Houston, TX.

Aqueous Technologies Corporation

IONOX® I3302 Broad Spectrum Electronics Cleaner

IONOX® I3302 Broad Spectrum Electronics Cleaner

New Equipment | Cleaning Agents

Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.

KYZEN Corporation

Loctite GC 3W – The Water Wash, Temperature Stable Game Changing Solder Paste

Industry News | 2015-09-28 10:29:02.0

Introducing LOCTITE GC 3W – The first ever water soluble / water wash temperature stable solder paste.

Blue Thunder Technologies, Inc.

IONOX® FCR - High Strength Semi-Aqueous Electronics Cleaner

IONOX® FCR - High Strength Semi-Aqueous Electronics Cleaner

New Equipment | Cleaning Agents

IONOX® FCR is a solvent blend designed for removing rosin, low solids and water soluble fluxes while being environmentally friendly. Easy to use, FCR is applied as received. A water rinse is required to remove all traces of soils and cleaner residues

KYZEN Corporation

KYZEN to Focus Industry on High-Quality Stencil Cleaning at productronica

Industry News | 2015-10-26 19:13:49.0

KYZEN global headquarters shared details regarding its exhibit and technical offering to be revealed in Hall A4, Booth 409 at the productronica International Trade Fair, Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. KYZEN electronics manufacturing experts will showcase a suite of high precision cleaning products engineered specifically to reliably achieve today’s demanding stencil cleaning performance requirements.

KYZEN Corporation

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

AQUANOX® A4625B - Aqueous Batch Cleaning Solution

AQUANOX® A4625B - Aqueous Batch Cleaning Solution

New Equipment | Cleaning Agents

AQUANOX® A4625B is an innovative aqueous chemistry designed for optimum effectiveness in batch washers. This easy to use product will remove all types of electronic flux residues including the latest lead free. AQUANOX® A4625B is environmentally fri

KYZEN Corporation

ALPHA® Preforms with solder paste adds solder volume.

ALPHA® Preforms with solder paste adds solder volume.

Videos

ALPHA® Preforms with solder paste adds solder volume.

MacDermid Alpha Electronics Solutions

FCT to Showcase Advanced Printing Technologies at APEX 2016

Industry News | 2016-02-25 12:54:53.0

FCT Assembly (www.fctassembly.com), well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of printing products at IPC APEX 2016 (www.ipcapexexpo.org), as well as take part in multiple technical conference programs. From booth # 1139 over March 15 - 17, the FCT exhibit will play host to the company’s various technologies including innovative step/relief stencil capabilities, NanoSlic Gold coated stencil and newly formulated, pre-released water soluble paste, WS890.

FCT ASSEMBLY, INC.


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