New Equipment | Cleaning Agents
AQUANOX® A4625B is an innovative aqueous chemistry designed for optimum effectiveness in batch washers. This easy to use product will remove all types of electronic flux residues including the latest lead free. AQUANOX® A4625B is environmentally fri
New Equipment | Cleaning Agents
Aqueous Cleaner for Flip Chips and Advanced Packaging AQUANOX® A4520 is an aqueous blend designed to remove re-flowed pastes, tacky, no clean and a majority of lead free residues while exceeding industry standards for worker and environmental sa
New Equipment | Solder Materials
Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. Our offering includes leading lead-free, no-clean, halogen-free solder
Industry News | 2016-02-25 12:54:53.0
FCT Assembly (www.fctassembly.com), well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of printing products at IPC APEX 2016 (www.ipcapexexpo.org), as well as take part in multiple technical conference programs. From booth # 1139 over March 15 - 17, the FCT exhibit will play host to the company’s various technologies including innovative step/relief stencil capabilities, NanoSlic Gold coated stencil and newly formulated, pre-released water soluble paste, WS890.
ALPHA® Preforms with solder paste adds solder volume.
Industry News | 2011-09-21 13:59:11.0
FCT Assembly announces that it will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #206 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2012-01-24 16:23:30.0
FCT Assembly will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #612 at the upcoming IPC APEX Expo.
Industry News | 2010-03-24 12:57:09.0
GREELEY, CO — FCT Assembly to highlight its range of new solder pastes in booth 2317 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2016-06-22 16:15:35.0
KYZEN today announced plans to exhibit in Booth #305 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. KYZEN will exhibit MICRONOX® MX2302 for wafer bumping, Ionox® FCR for wire bonding and MICRONOX® 2707 for Cu pillar flip chip applications.
Industry News | 2009-04-13 16:23:27.0
ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
