6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed to provide a fast flow, lower-temperature cure for high-
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
New Equipment | Cleaning Agents
IONOX® BC is a general purpose semi-aqueous solvent blend specially designed for effective removal of flux residues and dried uncured adhesives. IONOX® BC is approved for manual stencil cleaning as well as underscreen wipe applications. Manufactur
New Equipment | Cleaning Equipment
SMT Stencil CLEANING MACHINE 5600 Demensions:600 x 1000 x 1600mm PCB width:50-400mm PCB Length:Max 460mm Pitches:10,20,30mm Product description: SMT Stencil CLEANING MACHINE 5600, Demensions:600 x 1000 x 1600mm, PCB width:50-400mm, PCB Length:
SMT Stencil CLEANING MACHINE 5600 Demensions:600 x 1000 x 1600mm PCB width:50-400mm PCB Length:Max 460mm Pitches:10,20,30mm Product description: SMT Stencil CLEANING MACHINE 5600, Demensions:600 x 1000 x 1600mm, PCB width:50-400mm, PCB Length:
PCBA CLEANING MACHINE 5600 Demensions:600 x 1000 x 1600mm PCB width:50-400mm PCB Length:Max 460mm Pitches:10,20,30mm Product description: PCBA CLEANING MACHINE 5600,Demensions:600 x 1000 x 1600mm,PCB width:50-400mm,PCB Length:Max 460mm,Pitches
New Equipment | Cleaning Equipment
SMT Stencil CLEANING MACHINE 5600 Demensions:600 x 1000 x 1600mm PCB width:50-400mm PCB Length:Max 460mm Pitches:10,20,30mm Product description: SMT Stencil CLEANING MACHINE 5600, Demensions:600 x 1000 x 1600mm, PCB width:50-400mm, PCB Length:
Technical Library | 2014-03-27 14:50:01.0
Because of the phase out of CFC's and HCFC's, standard solder pastes and fluxes evolved from RA and RMA fluxes, to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices.
Technical Library | 2022-02-16 15:34:32.0
Because of the phase-out of CFCs and HCFCs, standard solder pastes and fluxes evolved from RA and RMA fluxes to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices
Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
