Industry Directory | Manufacturer
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Product Description Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating mo
Technical Library | 2015-09-10 15:06:17.0
A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This non-reactive phosphorus-based material satisfies fire safety needs for a broad range of resins including epoxy, polyolefin, and polyamide. The combination of excellent flame retardant efficiency, high thermal stability and exceptional electrical properties is unique to this organophosphorus flame retardant and makes it a breakthrough technology for high speed, high frequency use in fast growing wireless and wired infrastructures. Resin performance data, including formulations with synergists, are presented in this paper.
Industry News | 2003-04-07 13:08:13.0
Cookson Electronics Equipment Announces Camalot XYFLEXPRO Microdot Dispensing Capabilities
M.G. Chemicals products include dusters and circuit coolers, cleaner / degreasers, flux removers, contact cleaners, protective coatings, epoxies, adhesives, RTV silicones, lubricants, EMI/RFI shielding coatings, thermal management products, prototypi
New Equipment | Tape and Reel Equipment
Accurate Carriers USA manufactures all of our custom-designed, embossed carrier tape, in house. Our engineers can design a pocket as simple, or as complex as needed to properly carry and protect your product. Tape sizes range from 8mm to 200mm and ar
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
Used SMT Equipment | General Purpose Test & Measurement
Description The Agilent 8594EM is a stand-alone, automated EMC precompliance analyzer that reduces the time it takes to find, measure and document radiated and conducted EMI emissions. It belongs to the Agilent 8590EM series of EMC analyzers, which
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 8568B-001 Spectrum Analyzer, 75 Ohm BNC Input, 100 Hz to 1500 MHz A high-performance, 100 Hz to 1.5 GHz spectrum analyzer for bench and ATE use. The exceptional frequency stability of the HP 8568B permits measurements with a 10
Industry News | 2021-04-15 12:14:33.0
At Indium Corporation, we believe that materials science changes the world. In recognition of the notable material behind our name, we will release monthly installments of the Elements of Indium Series--an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49th element.
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