New Equipment | Assembly Services
Do you need rapid PCB prototyping with quick turnaround times? For the past 11 years, engineers, assemblers, and designers from around the world have counted on us for their quick turn PCBs. Companies big and small know that they can depend on us f
Industry News | 2007-10-04 14:11:34.0
WESTMORELAND, N.H. � September 25, 2007 � The leader in harsh environment label materials for product marking and industrial identification, Polyonics Inc., announces it will showcase its RoHS compliant Color Polyimide Labels in booth 113 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Industry News | 2012-11-06 11:14:19.0
Kyzen recently conducted a benchmarking of its polyimide label materials against Kyzen’s AQUANOX product line.
Industry News | 2018-12-08 03:24:24.0
RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
Industry News | 2009-12-07 19:02:26.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will feature AQUANOX® A4241 PCB and Stencil Cleaner and CYBERSOLV® 141-R Precision Cleaner in Hall A2, Stand 340 at the upcoming Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2014-06-17 21:50:29.0
SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.
New Equipment | Cleaning Agents
440-R® SMT Detergent is the only stencil-cleaning chemistry verified by the U.S. EPA for specific parameters of environmental safety, user safety and cleaning efficiency and is the only stencil-cleaning chemistry to "survive the test of time". 440-R
Industry News | 2015-03-16 11:44:31.0
PNC is proud to announce the latest add-on qualification of product testing to Military Performance Specification MIL-PRF-31032, CAGE Code 66766.
Industry News | 2024-02-19 12:43:52.0
KYZEN will exhibit at the SMTA Capital Expo and Tech Forum, scheduled to take place Thursday, March 7, 2024, at Sweeney Barn in Manassas, Virginia. The KYZEN Clean Team will provide expert insight on improving stencil cleaning processes and information about the KYZEN E5631 and E5631J solutions.
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