Industry News | 2014-05-13 17:01:55.0
Indium Corporation's Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23. Wilson's presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
Industry News | 2014-07-28 08:03:55.0
Techcon Systems has introduced a new brochure entitled, “Medical Device Assembly Process Key Factors to Consider.”
Industry News | 2014-09-22 17:28:29.0
Computrol, Inc. announces that it will exhibit in Booth #225 at AmCon, scheduled to take place Oct. 22-23, 2014 at the Salt Palace Convention Center in Salt Lake City, UT.
Industry News | 2014-09-26 21:34:29.0
Computrol, Inc. announces that it will exhibit in Booth #233 at Design 2 Part Portland, scheduled to take place Oct. 29-30, 2014 at the Portland Expo Center in Portland, OR.
Industry News | 2015-07-21 08:01:30.0
KYZEN’s will exhibit in booth #A-1P01 at NEPCON South China 2015, scheduled to take place August 25-27, 2015 at the Shenzhen Convention & Exhibition Center. KYZEN’s team will display the globally acclaimed, advanced technology AQUANOX® A4708, which already has won three industry awards since its debut earlier this year.
Industry News | 2015-11-01 18:53:43.0
KYZEN announces that it will exhibit at the SMTA LA/Orange County Expo & Tech Forum, scheduled to take place Thursday, Nov. 5, 2015 at The Grand Event Center. The KYZEN team will be available to answer cleaning questions, and will have the AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry on display.
Industry News | 2019-07-17 20:12:21.0
Super PCB will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, Aug. 8, 2019 at the Holiday Inn Cleveland Strongsville. The team will display samples of a number of Super PCB products, including single layer, two-layer, multilayer rigid PCBs, flex PCBs, rigid flex PCBs, Aluminum PCBs for LED and Rogers PCBs for RF applications, HDI and more.
Industry News | 2023-12-11 12:32:10.0
Indium Corporation R&D Sintering Project Manager Demi Yao will deliver a presentation on pressure-less copper sintering paste for die-attach applications at the Electronics Packaging Technology Conference (EPTC) on December 8 in Singapore.
Industry News | 2024-05-20 10:37:16.0
KYZEN is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. Visitors can find KYZEN at Hall 5, Stand 100, where the focus will be on advanced packaging solutions, specifically highlighting the MICRONOX® MX2123 Multi-Process Power Module Cleaner.
Industry News | 2008-08-22 20:54:55.0
SINGAPORE, 12 August 2008 � With the global outlook for 2008 shadowed by rising oil prices, accelerating inflation in both China and India, and the health of the U.S. economy, sentiment for
