Industry Directory | Manufacturer
Ircon is a leading manufacturer of thermal imaging equipment, infrared thermometers, and pyrometers. We specialize in non-contact temperature measurement. www.ircon.com
The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
New Equipment | Cable & Wire Harness Equipment
Overview Schleuniger's PullTester 26 is a dual-range, motorized benchtop device designed to measure pull forces of wire crimp connections as well as ultrasonic metal welding connections on a wider range of wire than single-range pull test devices.
Electronics Forum | Wed Apr 16 13:19:13 EDT 2003 | Takfire
Thanks Russ! The origianal complaint from the customer was in regards to what appeared as "bumpy" appearance and "holes" in the solder fillet. This problem was originally presented as an appearance issue only. Further investigation by our DPA lab r
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Industry News | 2015-01-07 15:52:18.0
The SMTA is pleased to announce the Best Papers from SMTA International 2014. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Industry News | 2019-05-31 08:50:57.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
This video presents how to replace and inspect BGA on PCB with our BGA rework station R720 & X ray inspection machine X6600. More details, pls contact me: WhatsApp?+86 18779975930 Skype?joyrongzhuomao@outlook.com Email: sales25@zhuomao.com.cn Link
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Wed Aug 16 00:00:00 EDT 2017 - Sat Aug 19 00:00:00 EDT 2017 | Harbin, China
ICEPT 2017, The 18th International Conference on Electronic Packaging Technology
SMTnet Express, May 19, 2022, Subscribers: 25,528, Companies: 11,568, Users: 27,231 Electronics Manufacturing Technical Articles Non-Destructive Characterization of Mechanically Processed Waste Printed Circuit Boards: X
SMTnet Express, March 24, 2022, Subscribers: 25,784, Companies: 11,563, Users: 27,157 XRF Technology In The Field - XRF Technology For Non-Scientists X-ray fluorescence (XRF): a non-destructive analytical technique used
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/aerospace?con=t
functions that are required across a wide range of areas. Nordson DAGE bondtesters provide the accuracy that is essential for both destructive and non-destructive mechanical test evaluation to be performed in a repeatable manner, for both the development of
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
Ball Grid Array Packages with Various Pitch Sizes and Ball Alignments" 2014: Jie Gong, Ph.D., Georgia Institute of Technology "Non-Destructive Evaluation of Solder Bump Quality under Mechanical Bending Using Laser Ultrasonic Technique" ^ Hide ^ Premium
