New Equipment | ESD Control Supplies
Tip temperatures Antistatic wrist straps and heel/toe grounders Ionizing equipment http://www.selen.hr/pokaz_kategorie.php?cid=90
Electronics Forum | Tue Oct 10 19:11:58 EDT 2006 | Rfredericks
Hello, I've ran into information claiming that ESD dissipative floor mats and laminate is not effective unless paired with ESD footwear or heel straps. Can anyone confirm or deny? Thanks! -OtheRuss
Electronics Forum | Wed Oct 11 09:32:26 EDT 2006 | Rob
Correct. Remember, you need the charge to flow to earth from yourself, the heel strap/conductive shoes etc. facilitate this, otherwise you would stay charged no matter how good the floor was.
Industry News | 2013-10-01 18:25:31.0
STI Electronics, Inc., along with its partners from REStronics Southeast, 3M, Conductive Containers, Inc. and Tech Wear, will hold a 3M/CCI/Tech Wear ESD Workshop addressing Electrostatic Discharge, Packaging and Garments.
Industry News | 2019-09-26 12:16:40.0
Saki Corporation will present its 2D and 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems at Productronica India 2019. Productronica India is being held September 25-27 at the India Expo Center, Noida, Delhi, India. Saki technical experts will be available at the following booths: PCI booth PA11, iNETest booth PC11, and Prosem booth PE45.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
ALPHA® Preforms with solder paste adds solder volume.
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-adhesive-application.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Adhesive Conductive Adhesive & Non-Conductive Adhesive Conductive Adhesive is an electrically conductive material that adheres dies and other small components to substrates
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/terminal-dimensions-for-nonstandard-packages_topic3162_post12559.html
. Make the Heel value 0.35 mm and the side goal 0.05 mm. The terminal length is the white area that you define in your picture. The Pad Length is the Terminal Length + Toe + Heel
