Constellation Technology, in Largo, Florida, is an Independent Testing Laboratory that is accredited by the American Association for Laboratory Accreditation (A2LA) for non-destructive, mechanical, and chemical testing. We have assisted numerous comp
Industry Directory | Manufacturer
Designer and Manufacturer of Acoustic Microscopes for Non-destructive Ultrasonic Immersion Inspection and Semiconductor Package Failure Analysis.
New Equipment | Education/Training
Failure Analysis Techniques for Electronics provides an overview of the characterization methods available at ACI Technologies, Inc. for determining the causes of failure in electronics devices. This publication will assist the reader in making inf
Non-destructive infrared inspection system for circuit card assemblies. Uses high resolution infrared radiometers with WindowsNT software for image analysis.
Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a
C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.
Electronics Forum | Tue Jun 06 21:15:23 EDT 2017 | davef
I'd be surprised if you find a non-destructive method of removing carbon ink. Your best bet is following the recommendations of your ink supplier.
Industry News | 2018-04-11 20:04:01.0
SMTA Europe announces Session 3 Technical Program on Advanced Test Methods at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2010-06-16 14:00:47.0
Minneapolis, MN - The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. The conference will be held at the Walt Disney World Swan and Dolphin Resort in Orlando, Florida on October 24-28, 2010. This year's program allows the attendee to choose from 20 courses, 130 technical papers, 4 focused symposia, and numerous free offerings throughout the conference.
Technical Library | 2019-09-23 09:35:00.0
Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).
Technical Library | 2020-12-07 15:26:06.0
Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
CX-3500 is use to examine internal solder joints, BGA, IC and other complex components.It adopts the structure of high resolution enhanced screen and sealed microcoking X ray tube combination, through X-ray non-destructive fluoroscopy, real-time obse
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Apr 22 00:00:00 EDT 2021 - Thu Apr 22 00:00:00 EDT 2021 | ,
Ohio Chapter Meeting: Industry 4.0 / Non-Destructive Failure Analysis
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
SMTnet Express, May 19, 2022, Subscribers: 25,528, Companies: 11,568, Users: 27,231 Electronics Manufacturing Technical Articles Non-Destructive Characterization of Mechanically Processed Waste Printed Circuit Boards: X
Surface Mount Technology Association (SMTA) | https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=36
. Nevertheless misconceptions linger concerning the suitability of CT scanning as a nondestructive test and failure analysis methodology. This presentation will address some of those misconceptions by featuring 3 specific and recent applications of CT scanning, illustrating its wide potential for use as a diagnostic tool
