Industry Directory | Manufacturer
Ircon is a leading manufacturer of thermal imaging equipment, infrared thermometers, and pyrometers. We specialize in non-contact temperature measurement. www.ircon.com
Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
New Equipment | Cable & Wire Harness Equipment
Overview Schleuniger's PullTester 26 is a dual-range, motorized benchtop device designed to measure pull forces of wire crimp connections as well as ultrasonic metal welding connections on a wider range of wire than single-range pull test devices.
Electronics Forum | Fri Jan 07 07:45:44 EST 2011 | davef
Consider measuring the temperature of the BGA solder balls during reflow. This will give you a more accurate impression of the actual soldering temperature than you are getting now. The 1/6/2011 SMT Express Newsletter contained an interesting arti
Electronics Forum | Wed Apr 16 13:19:13 EDT 2003 | Takfire
Thanks Russ! The origianal complaint from the customer was in regards to what appeared as "bumpy" appearance and "holes" in the solder fillet. This problem was originally presented as an appearance issue only. Further investigation by our DPA lab r
Industry News | 2015-01-07 15:52:18.0
The SMTA is pleased to announce the Best Papers from SMTA International 2014. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Industry News | 2011-02-07 16:12:58.0
Teradyne, Inc. announced that registration is now open for the 2011 Teradyne Users Group (TUG) conference at the Hard Rock Hotel in San Diego, CA on May 2-4. Reza Zoughi, Ph.D. will present this year's keynote address: "Advances in Microwave and Millimeter Wave Imaging and System Development for Nondestructive Testing & Evaluation (NDT&E)."
Technical Library | 2011-01-06 18:03:18.0
The oven recipe, which consists of the reflow oven zone temperature settings and the speed of the conveyor, will determine a specific time‐temperature profile for a given PCB assembly. In order to achieve a good quality PCB assembly, the time‐temperature
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
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Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Wed Aug 16 00:00:00 EDT 2017 - Sat Aug 19 00:00:00 EDT 2017 | Harbin, China
ICEPT 2017, The 18th International Conference on Electronic Packaging Technology
Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling The oven recipe, which consists
SMTnet Express, May 19, 2022, Subscribers: 25,528, Companies: 11,568, Users: 27,231 Electronics Manufacturing Technical Articles Non-Destructive Characterization of Mechanically Processed Waste Printed Circuit Boards: X
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
Nondestructive Testing (ASNT) as well as the European Institute of Printed Circuits (EIPC). Since 2013 Robert has co-authored the Test and Measurement column for Circuits Assembly Magazine. Tara Dunn is a seasoned professional with more than 20 years in the
