Industry News | 2014-09-22 10:40:15.0
YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2021-06-02 05:34:04.0
EasySpheres is the exclusive worldwide provider of high quality, first run solder balls at reasonable quantities and excellent prices. The company is a leading provider and technical guide to many of the solder attach and bumping challenges that customers face today.
Industry News | 2022-08-14 14:16:58.0
Test Research, Inc. (TRI) will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 14 - 16, 2022. Visit booth #M1034 to experience the latest in Smart Factory Semiconductor Inspection.
Industry News | 2020-11-18 15:38:26.0
CyberOptics® Corporation (NASDAQ: CYBE) will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT.
Industry News | 2015-10-11 16:19:40.0
Photo Stencil announces that Susan Holmes, VP engineering and customer service for Photo Stencil, will present the paper Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the IWLPC during Session 10 on Wednesday, October 14, 2015, at 5:00 PM. The 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition is being held at the Doubletree San Jose Airport Hotel, San Jose, CA.
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
