Industry News | 2018-06-03 19:11:33.0
SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.
Industry News | 2003-04-16 10:58:03.0
Award presented for Palomar's Gold Connection
Industry News | 2020-01-07 11:42:27.0
Practical Components announces that it will showcase its advanced technologies at the IPC APEX exhibition in booth 1600 scheduled to take place February 4-6, 2020 at the San Diego Convention Center in San Diego California.
Industry News | 2014-08-12 16:03:12.0
(Albany, NY) August 12, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.
Industry News | 2008-02-15 15:10:03.0
DEK�s has appointed a new Process Manufacturing Engineer to further enhance its stencil production for customers. Kent Ang, an accomplished stencil specialist, has been promoted from Electroform Process Engineer to take on the new role in the company�s Asia Pacific division.
Industry News | 2021-08-13 12:16:35.0
CyberOptics® Corporation (NASDAQ: CYBE) will feature the WX3000™ metrology and inspection system with MRS™ sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the VirtualConnecting Heterogeneous Systems Summit Sept. 1-3, 2021.
Industry News | 2021-10-11 08:08:21.0
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, announces the release of its new Meister D+ semiconductor inspection solution. Premium True3D™ Inspection Solution for Chiplets and System-in-Package (SiP) devices including die and surface mount components. The new Meister D+ is an extension of the Meister product family that features solutions ranging from solder paste, printed bumps, and solder ball to small components like 0201Ms and highly reflective die.
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
Industry News | 2021-03-12 04:57:42.0
CyberOptics® Corporation (NASDAQ: CYBE) will feature the WX3000™ metrology and inspection system with Multi-Reflection Suppression™ (MRS™) sensor technologyat SEMICON China,scheduled to take place March 17-19, 2021 at the Shanghai New International Expo Centre, hall N1, booth 1387 and 1325. The company also will demonstrate high-precision WaferSense® sensors for semiconductor tool setup and diagnostics.
Industry News | 2015-11-03 10:54:44.0
LOS ALAMITOS, CA — November 2015 — Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces that it will showcase its latest technology in representative AAT Aston’s exhibit at Hall A2 Stand 578 scheduled to take place November 10-13, 2015 at the New Munich Trade Fair Center in Munich, Germany.
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