New Equipment | Education/Training
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure
New Equipment | Education/Training
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure
Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
Industry News | 2003-03-06 08:43:16.0
Under pressure to fulfill growing repair obligations in the United States, some OEMs and EMS companies are outsourcing projects to product-lifecycle managers.
Industry News | 2010-04-10 02:05:54.0
IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.
Technical Library | 2016-04-14 13:49:44.0
A system level test, usually built-in test (BIT), determines that one or more subsystems are faulty. These subsystems sent to the depot or factory repair facility, called units under test (UUTs) often pass that test, an event we call No-Fault-Found (NFF). With more-and more electronics monitored by BIT, it is more likely that an intermittent glitch will trigger a call for a maintenance action resulting in NFF. NFFs are often confused with false alarm (FA), cannot duplicate (CNDs)or retest OK (RTOK) events. NFFs at the depot are caused by FAs, CNDs, RTOKs as well as a number of other complications. Attempting to repair NFF scan waste precious resources, compromise confidence in the product, create customer dissatisfaction, and the repair quality remains a mystery. The problem is compounded by previous work showing that most failure indications calling for repair action at the system level are invalid. NFFs can be caused by real failures or may be a result of system level false alarms. Understanding the cause of the problem may help us distinguish between units under test (UUTs) that we can repair and those that we cannot. In calculating the true cost of repair we must account for wasted effort in attempting to repair unrepairable UUTs.This paper will shed some light on this trade-off. Finally, we will explore approaches for dealing with the NFF issue in a cost effective manner.
Technical Library | 2024-09-02 17:31:09.0
The cracking and delamination of printed circuit boards (PCB) during exposure to elevated thermal exposure, such as reflow and rework, have always been a concern for the electronics industry. However, with the increasing spread of Pb-free assembly into industries with lower volume and higher complexity, the occurrence of these events is increasing in frequency. Several telecom and enterprise original equipment manufacturers (OEMs) have reported that the robustness of their PCBs is their number one concern during the transition from SnPb to Pb-free product. Cracking and delamination within PCBs can be cohesive or adhesive in nature and can occur within the weave, along the weave, or at the copper/epoxy interface (see Figure 1). The particular role of moisture absorption and other PCB material properties, such as out of plane expansion on this phenomenon is still being debated.
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Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Article Return to Front Page Rework Management and Opti
SMT Express, Issue No. 6 - from SMTnet.com Volume 1, Issue No. 6 Monday, November 22, 1999 Featured Article Return to Front Page Rework Management and Optimization Learning how to manage the amount of time and money spent on rework can increase
Lewis & Clark | https://www.lewis-clark.com/product-tag/rework-station/
rework Station Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. The lateses processes, materials, equipment and techniques for rework of BGA, QFN, LGA, PoP and other SMD components. Key Topics Include: A review of the parameters for establishing a safe thermal profile
