Industry News | 2017-11-07 17:54:38.0
JTAG Technologies is excited to announce the latest version of its acclaimed Visualizer graphical viewing tool for board (PCB) layouts and schematics. Allowing users to assess fault coverage data and pin-point production test faults in a snap.
New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Industry News | 2018-01-16 17:25:38.0
The speed of change in the electronics industry is rapidly accelerating. The direction in which the industry moves is constantly shifting...and it needs participation, see you in San Diego! JTAG Technologies is excited to showcase here in San Diego the latest version of its acclaimed Visualizer graphical viewing tool for board (PCB) layouts and schematics. Allowing users to assess fault coverage data and pin-point production test faults in a snap.
Electronics Forum | Thu Jun 29 10:53:30 EDT 2023 | matouschekd
Repairing these PCBs was not an option due to the delivery amount. Oxidation is unlikely, as these anomalies were visible right after unpacking them and the humidity card was not suspicious. We have since decided not to use these PCBs as the risks w
Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001
I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Mon Jun 07 10:57:31 EDT 1999 | Dave F
| | | | Where I can find some informations about repairing of SMT boards? | | | | | | | | Thanks | | | | | | | | Marcos | | | | | | | A first place to start is IPC's 7711 and 7721 encompasing repair, modification, and rework procedures. | | | |
Electronics Forum | Mon Mar 20 19:27:14 EST 2000 | Marc Ruggiero
Hello, I am looking for inputs (experiential or opinions) concerning field reliability of high-frequency RF boards that have had a trace or pad repair (or both), any package type. If anyone can comment on this subject, I would appreciate it. We bu
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