Electronics Forum | Thu Feb 04 15:44:04 EST 1999 | Michael Allen
Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). | | I'd like to find some t
Electronics Forum | Thu Feb 04 18:45:56 EST 1999 | Earl Moon
| Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). Michael, In the "real wo
Electronics Forum | Wed Feb 03 18:32:07 EST 1999 | Earl Moon
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Wed Feb 03 16:38:19 EST 1999 | Steve Gregory
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Thu Feb 04 10:00:26 EST 1999 | Terry Burnette
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Wed Feb 03 22:37:50 EST 1999 | Dave F
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef
From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff
Electronics Forum | Mon Jun 07 10:52:04 EDT 1999 | Brian Wycoff
| | | | Where I can find some informations about repairing of SMT boards? | | | | | | | | Thanks | | | | | | | | Marcos | | | | | | | A first place to start is IPC's 7711 and 7721 encompasing repair, modification, and rework procedures. | | | |
Electronics Forum | Tue Oct 16 14:18:41 EDT 2012 | ericrr
My guess is a manual machine would be good for a after sales "repair station" or the engineers doing product development, without it you would have almost drop a large integrated circuit (IC) on to the spot and poke around with it moving it sideways
Electronics Forum | Thu Jul 01 20:47:48 EDT 1999 | Scott McKee
I called a new customer today and told him that one of his parts on the proto boards (a capacitor with a polarity 'tit') was too long for the pads and the pads were small causing the end opposite of the "tit" to lift up. I suggested that the product
