Electronics Forum | Thu Jun 29 10:53:30 EDT 2023 | matouschekd
Repairing these PCBs was not an option due to the delivery amount. Oxidation is unlikely, as these anomalies were visible right after unpacking them and the humidity card was not suspicious. We have since decided not to use these PCBs as the risks w
Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001
I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te
Used SMT Equipment | Board Cleaners
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Industry News | 2015-04-23 16:30:38.0
Metcal is pleased to announce that SMTA China awarded its Applications Manager, Paul Wood, ‘The Best Presentation of Vendor Conference One’ for the presentation titled “Why Non-Contact Array Solder Clean Up is required.” The award was presented during the SMTA China East 2015 Conference Award Presentation Ceremony on April 22, 2015 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2011-02-05 14:02:52.0
IPC announces its Winter Webinar Series for February and March 2011. Focused on technical challenges facing the electronics manufacturing industry, including lead-free reliability issues, high voltage PCB design, package on package (PoP) assemblies, PoP component manufacturing, thermal cycle testing and barrel failures, the one-hour webinars offer companies a great opportunity to bring IPC technical information to a large number of employees at one time.
Parts & Supplies | SMT Equipment
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Technical Library | 2016-04-14 13:49:44.0
A system level test, usually built-in test (BIT), determines that one or more subsystems are faulty. These subsystems sent to the depot or factory repair facility, called units under test (UUTs) often pass that test, an event we call No-Fault-Found (NFF). With more-and more electronics monitored by BIT, it is more likely that an intermittent glitch will trigger a call for a maintenance action resulting in NFF. NFFs are often confused with false alarm (FA), cannot duplicate (CNDs)or retest OK (RTOK) events. NFFs at the depot are caused by FAs, CNDs, RTOKs as well as a number of other complications. Attempting to repair NFF scan waste precious resources, compromise confidence in the product, create customer dissatisfaction, and the repair quality remains a mystery. The problem is compounded by previous work showing that most failure indications calling for repair action at the system level are invalid. NFFs can be caused by real failures or may be a result of system level false alarms. Understanding the cause of the problem may help us distinguish between units under test (UUTs) that we can repair and those that we cannot. In calculating the true cost of repair we must account for wasted effort in attempting to repair unrepairable UUTs.This paper will shed some light on this trade-off. Finally, we will explore approaches for dealing with the NFF issue in a cost effective manner.
Technical Library | 2009-05-14 13:57:43.0
Is screen printing technology able to keep pace with rising quality demands and increasingly complex board layouts? Or, is new jet printing technology ready to fill the gap? A comparison study between the two methods reveals some interesting differences. Screen printers offer some possibilities for optimizing solder paste deposits, but optimization is far easier and quicker with the jet printer. At the same time, the ability to print individualized deposits on every single pcb pad may be the ultimate answer to the growing quality challenge.
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Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Voiding Control for QFN Assembly Voiding Control for QFN Assembly Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size
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