Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon
| I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over
Electronics Forum | Thu Dec 16 11:54:45 EST 1999 | Mike Naddra
At reflow an inert atmosphere is used to mitigate the occurance of oxidation, to me the decision weather to move from an inert atmosphere is based on several things ; PCB surface finish - are you using a HASL finish, OSP or another surface finish and
Electronics Forum | Tue Dec 21 18:09:24 EST 1999 | Brian W.
I have been soldering 0603 components on the bottom side using a glue and wave solder process for a long time. Bridging has not been a common problem. However, it is inherent on the design engineers to follow good manufacturability planning when la
Electronics Forum | Mon Aug 28 18:57:41 EDT 2000 | Earl Moon
Steve, This is a good, well repeated, not identified by IPC yet issue. I, and some others in industry, for years have proven and recommended smaller pads for various devices. I, and some others in industry, use 0402 pads for 0603 device types. IPC o
Electronics Forum | Thu Aug 22 01:57:30 EDT 2002 | Bob Willis
Although the following is not true capability machine assesment I feel that monioring the process at screen print, placement, reflow and wave gives results for both design and process guys to asses thire process. The project has been running since Ma
Electronics Forum | Fri Jan 05 12:17:31 EST 2007 | Cmiller
Our first pass yield across all our products is above 95% but we include anything that does not meet IPC standards. Probably 75% of our failures are not electrical. AOI is a great tool to get a consistent measure of your process. I dont know how anyo
Electronics Forum | Thu Jun 13 14:41:40 EDT 2024 | tommy_magyar
Hi David, In one of my previous jobs I worked as an AOI/AXI process engineer and we had a set target of 75% FPY. This means that 75% of the boards at IPC Class 3 standards would not have a single false call. This also means you would need to set y
Electronics Forum | Thu Aug 15 15:44:46 EDT 2002 | dragonslayr
You can't control what you don't measure. You have provided very little detail other than post reflow costs are high. What defects are attributed to problems experienced prior to reflow? Are these random or recurring defects? You will need to put ea
Electronics Forum | Sat Dec 16 10:03:32 EST 2000 | Dave F
Castellation. A recessed metalized feature on the edge of a leadless chip carrier [LCC] that is used to interconnect conducting surface or planes within or on the chip carrier. If you search the fine SMTnet Archives, you find: * A fine thread [cast
Electronics Forum | Mon May 06 12:44:50 EDT 2002 | Bob Willis
The SMART Group is starting a new project on PPM Monitoring which will be providing average PPM yield data per month free to the industry. I would like to get feedback or exchange criteria for paste printing as non exists with in IPC or similar organ
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
.png)
