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Helping businesses find each other.
Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
ProntoPLACE used by electronics manufacturers will quickly program your surface mount SMT and thru-hole assembly equipment. In minutes Unisoft ProntoPLACE software translates CAD or Gerber and Bill of Materials (BOM) files into real reference desig
ProntoTEST-FIXTURE used by electronics manufacturers will accurately setup your Automatic Test Equipment (ATE), Flying Probe and design your "bed of nails" test fixturing. In minutes Unisoft ProntoTEST-FIXTURE software translates CAD and Bill of Ma
Electronics Forum | Wed Jan 17 05:05:30 EST 2007 | Phil J
The most likely cause is moisture vapor outgassing violently from the Tant package. They are known to be moisture sensitive. Try baking some at 120C overnight and reflowing those.
Electronics Forum | Wed Oct 30 09:37:48 EST 2002 | stepheno
One thing to take note of with the TSOP's is that is a T1 variety and a T2 variety. One has the leads on the sides, the other has leads on the ends. I believe the T1 has the leads on the ends, but I would have to look it up to be sure.
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Used SMT Equipment | SMT Equipment
Product name: KE - 2010 l JUKI chip mounter Product number: KE - 2010 l Products in detail Substrate size: Min: 50 mmx30mm Max: 330 mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square element or 26.5 X11mm Mo
Industry News | 2011-02-17 15:04:54.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.
Industry News | 2013-06-07 15:36:04.0
GPD Global has signed a partnership agreement with Aegis Software to distribute CircuitCAM Express data translation software.
Parts & Supplies | SMT Equipment
SMT Cleanroom Microfibre Wiper paper Applications: Superior for spill control and general wiping in Class10~1,000 environments; Cleaning and polishing the products TFT-LCD, Optical and other critical industries etc.request; Maintaining critica
Parts & Supplies | Assembly Accessories
Detailed Product Description Original: China Name: IC Tray Holder Conditon: Brand New Brand: JUKI Material: Metal Stocks: Yes Metal Black SMT Spare Parts , Standard JUKI IC Tray Holder 330X310 Description: 1, Original Place: China 2, P
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
ProntoGERBER-CONNECTION software is used by electronic manufacturer & imports raw Gerber data & allows the user to add intelligent information to the shapes on the display and creates real reference designators, theta rotation, part numbers, X/Y comp
www.unisoft-cim.com/pcbplace.htm - The ProntoPLACE module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB assembly machines in minutes. ProntoPLACE programs most popular surface mount (SMT) place
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | San Jose, California USA | Engineering,Research and Development
Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for
Career Center | , | Maintenance
Specialized in Siemens equipment, and OmniExcel 7, MPM Ap25, Momentum.
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf
). Note: The calculations in this manual for the Station counter box settings are for flush- mount and stand-off forms only. For all other forms, refer to the CF-8 Formula Calculator Package (part no. 8201622) which automatically calculates the Station
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/odb--future-v-gerber-or-something-else_topic579_post1875.html
it's way to becoming the industry standard. But as soon as Mentor Graphics acquistioned Valor and now Mentor owns ODB++, no other CAD vendor wants to support it. Cadence, Zuken, Integraph, Downstream, Wise Software and many other companies are pooling
