Industry Directory | Manufacturer
K. Nissoy kai Sia O.E. was established in 2006 and is a Greek Electronic Manufacturing Services provider. Our services include:PCB Assembly,Cable Assembly,Industrial Applications and Conformal Coating
New Equipment | Test Equipment
Reliability testing solutions have lagged behind, until now. Introducing Magnalytix® OE-250 Remember the ROSE test? An industry standard for decades, it is no longer accepted by IPC J-STD as adequate objective evidence of product quality. Our f
S200-OE4 S200OE4 ABB New brand Contact Us Jim.Sales Manager Email: sales6@amikon.cn Skype：live:sapphire_264 Tel: +86-592-5322116 Whatsapp:+8618020776782 Why Choose Us? Integrity, reliability and honesty are the most important principles of
Used SMT Equipment | Soldering - Reflow
Used Electrovert Omnies7 build date 3/12 Serial# OES7-20032 480V 3ph kva 37 hz60 Seven zone topside only oven! Oven will need three blower motors.(zone 1 and two cooling zones) i will give all extra motors i have to rebuil
Used SMT Equipment | In-Circuit Testers
Agilent 83440D-012 The 83440 lightwave converters are fast, accurate, DC-coupled optical-to- electrical (O/E) converters packaged as small optical probes. They mount directly to electrical instrument front panels to simplify integration and minim
Industry News | 2017-02-06 14:54:55.0
IPC's Validation Services Program has awarded an IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) to Pana-Pacific, an electronic parts supplier to the commercial vehicle industry. Following an initial audit by IPC, Pana-Pacific becomes one of the trusted sources and suppliers meeting the stringent requirements of the Qualified Manufacturing Listing based on IPC's foremost standard: IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.
Industry News | 2022-12-16 03:31:21.0
I.C.T | SMT Auto Stencil Printer Introduction Livestream Preview.
Technical Library | 2016-07-07 15:37:18.0
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest, especially to manufacturers, retailers and to a certain extent end customers. In this study the dissolution of aluminum, copper, gold, iron, lead, nickel, SAC305 solder, silver, tin and zinc was examined. Individual foils of these materials were fully immersed in one of sixteen chosen beverages and heated for 3 days at 40°C. The resulting solutions were analyzed using ICP-OES. The data were examined in light of the known pH, conductivity and ionic contents of the beverages, determined in previous work. Conclusions about the relative susceptibility to corrosion of the various metals and the corrosive power of the different beverages are made.
Technical Library | 2018-01-17 22:47:02.0
Fine pitch copper (Cu) Pillar bump has been growing adoption in high performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities, thus assembling such packages using a standard mass reflow (MR) process and maintaining its performance is a real and serious challenge. (...) In this study a comprehensive finding on the assembly challenges, package design, and reliability data will be published. Originally published in the SMTA International 2016
I.C.T | SMT Auto Stencil Printer Introduction Livestream Preview. Welcome to our livestream. See you soon～ https://youtu.be/I4--i_kOeNc
03043707-01 SILENCER / C+P20 cplt. 03043753-02 nozzle station cplt. C+P20 03043756-02 air service unit F-D 03044000-01 Safety Switch AZ16 1S+1Oe 5N 03044311-01 Y-Axis Cover Air Filter 03044362-01 Strain relief bracket 10pole 0304444
Career Center | Katerini, Greece | Sales/Marketing
K. Nissoy kai Sia OE is a Greek EMS provider certified in accordance with ISO 9001:2008. We specialize in SMT and THT assemblies as well as Cable assemblies and Conformal Coating of products. We are currently seeking for a commissioned based Indepe
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip
