Industry News | 2016-06-27 14:54:49.0
In September of 2015, IPC delivered revision D of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards. Building on this base standard, IPC has developed the first automotive addendum, IPC-6012DA, Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2016-04-13 16:56:22.0
The SMTA Capital Chapter is pleased to announce it will welcome Martin K. Anselm, Ph.D., Rochester Institute of Technology, on June 2nd to instruct a tutorial on SMT Principles at Zentech Manufacturing an ITAR facility located at 6980 Tudsbury Road, Baltimore, MD, 21244. The tutorial is scheduled from 8:30 am to 4:00 pm and includes lunch and a tour. As Zentech is an ITAR facility only US Citizens can participate in the tour. This tutorial is designed for those involved in printed board design, bare board fabrication, SMT assembly, quality control, materials purchasing, and reliability testing. New this year! Get a $20 EARLY BIRD discount on regular member and non-member registrations if registration is completed by midnight on April 30, 2016. Registration is required for this learning event.
Industry News | 2019-06-26 19:57:27.0
IPC is applauding the U.S. House of Representatives for approving a measure that would promote research and development into the performance of lead-free electronics in high-reliability sectors such as aerospace, defense, automotive, and medical equipment.
Industry News | 2021-03-25 15:48:41.0
The SMTA Officer team is excited to provide our members with a new webinar by Dr. Nathan Blattau, R&D Fellow at Ansys, Inc., on "Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems." The webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.
Industry News | 2017-08-01 06:08:55.0
The SMTA is pleased to announce that Mike Bixenman, DBA, KYZEN Corporation was selected to win the “Best of Presentation” Award at the 2017 International Conference on Soldering and Reliability (ICSR) for his presentation “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach.” The award is determined through the evaluations of those that attended the presentation.
Industry News | 2003-06-11 08:00:48.0
IPC has begun a comprehensive study of the three leading lead-free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead-free assembly.
Industry News | 2013-10-01 18:16:06.0
A dozen experts from organizations in Asia, Europe and North America will present strategies for enhancing reliability in electronics assemblies on 19–20 November in Bangkok.
Industry News | 2016-10-13 16:00:08.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Industry News | 2012-06-18 14:49:38.0
Reliability and Failure Analysis Seminar: Lessons Learned in Manufacturing. Presented by Universal Instruments Corporation’s Advanced Process Laboratory. Hosted by Textron Defense Systems, 201 Lowell St., Wilmington, MA
Industry News | 2014-01-29 10:18:33.0
The SMTA Capital Chapter is pleased to announce its first meeting of 2014 on March 4th, from 5:30 pm until 8 pm at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723.
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