Technical Library | 2021-12-16 01:52:32.0
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.
Industry News | 2015-05-12 16:45:37.0
Kurtz Ersa North America today announced that Pennsylvania-based Zober Industries, Inc. has purchased and installed its ECOSELECT 2 Selective Soldering System. Based on its evaluations, Zober Industries determined that the ECOSELECT 2 is ideally suited for operation in its modular production lines. The system is the optimal solution for small and medium scale production where flexibility is paramount.
Technical Library | 2010-07-08 19:56:15.0
As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in the electronics industry, SAC 305 is the most widely used solder, making it a high priority to understand its long-term stability and performance in a variety of service conditions. Recent evidence has shifted the focus from thermal aging to reflow temperature and time above liquidus values during initial solder melting.
Industry News | 2014-10-01 13:40:18.0
Metcal announces that it was awarded a 2014 Global Technology Award in the category of Rework & Repair for its APR-1200A-SRS-MOB: Metcal Scorpion Rework System, SmartPlace Technology (Mobile) & Automatic Placement Package.
Industry News | 2014-10-01 13:41:26.0
Metcal announces that it was awarded a 2014 Global Technology Award in the category of Rework & Repair for its APR-1200A-SRS-MOB: Metcal Scorpion Rework System, SmartPlace Technology (Mobile) & Automatic Placement Package.
Industry News | 2015-10-26 19:13:49.0
KYZEN global headquarters shared details regarding its exhibit and technical offering to be revealed in Hall A4, Booth 409 at the productronica International Trade Fair, Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. KYZEN electronics manufacturing experts will showcase a suite of high precision cleaning products engineered specifically to reliably achieve today’s demanding stencil cleaning performance requirements.
Industry News | 2017-11-05 08:55:02.0
Removing contamination from printed circuit boards remains a huge reliability and warranty issue for PCB manufacturers. One of the cleaning experts from MicroCare Corp., the industry’s leading manufacturer of critical cleaning products, addressed that specific issue at the Texas Cleaning and Reliability Workshops in Austin and Dallas on Oct. 23rd and 25th, 2017.
Industry News | 2019-09-20 08:45:31.0
09.19.2019 – Boca Raton – “Having worked in the electronics manufacturing industry since graduating from University of Maryland in 1980 with a BSEE, it’s truly puzzling to me that sophisticated machines capturing so much data have not been used to their full potential”, says Frank Mascetti, Owner of Technical Resources Corporation (TRC). For decades, he has witnessed this with respect to semiconductor test systems to In-Circuit Test to assembly and inspection machines alike. When he transitioned from electrical engineering into his sales profession many years ago, he listened to “spinmeisters” who worked very hard on creating a story with sales collateral. The companies acted like “it’s simply magic” and we can “plug all these boxes into one another.” In short, “Industry 4.0 will solve everything.”
Technical Library | 2019-03-06 21:26:14.0
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However, variability in the mechanical properties such as the coefficient of thermal expansion and elastic modulus effects the material selection process by introducing uncertainty to the long term impacts on the reliability of the electronics. Typically, the main reliability issue is solder joint fatigue which accounts for a large amount of failures in electronic components. Therefore, it is necessary to understand the effect of polymer encapsulations (coatings, pottings and underfills) on the solder joints when predicting reliability.This paper presents the construction and validation of a thermo-mechanical tensile fatigue specimen. The thermal cycling range was matched with potting expansion properties in order to vary the magnitude of tensile stress imposed on solder joints
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
