Technical Library | 2021-08-25 16:28:36.0
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 #14;C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from
Technical Library | 2009-10-29 11:45:52.0
The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to reduce production costs whilst maintaining a consistently high quality level of the manufactured products. Manual repair soldering that is expensive, time-consuming and cost intensive is already unacceptable due to the required quality and the reproducibility of the whole manufacturing process.
Technical Library | 2021-05-13 16:03:25.0
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutecticSn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed
Technical Library | 2023-06-14 01:09:26.0
In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In this work, an investigation on the Anand constitutive model and its application to SAC solders of various Ag contents (i.e. SACN05, with N = 1, 2, 3, 4) has been performed. For each alloy, both water quenched (WQ) and reflowed (RF) solidification profiles were utilized to establish two unique specimen microstructures, and the same reflow profile was used for all four of the SAC alloys so that the results could be compared and the effects of Ag content could be studied systematically.
Industry News | 2016-09-14 17:40:11.0
PROMATION has been published in this months edition Circuits Assembly Magazine outlining the ROI potential of a solder robot vs. hand soldering.
Technical Library | 2015-01-08 17:26:59.0
Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption. Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern
Industry News | 2003-06-04 09:11:10.0
Concoat Systems has further expanded and enhanced its CM range of contamination testers (or contaminometers).
Industry News | 2017-02-15 15:28:12.0
Juki Corporation (Tama Center – Tokyo, Japan) and Juki Automation Systems (Morrisville, NC) are pleased to announce that William D. (Bill) Astle has been promoted to President of Juki Automation Systems, Inc. effective immediately. Bill has been serving as General Manager of JAS for the last three years. Robert J Black, Jr., former President and CEO, will remain with the company as CEO.
Industry News | 2019-01-17 17:06:16.0
Hover-Davis, the global leader in the design and manufacture of electronic component and media delivery solutions, will celebrate its 30 year anniversary at IPC APEX Expo in San Diego, CA on January 29-31 where it will display its latest feeder and material automation solutions.
Industry News | 2021-08-30 08:58:05.0
Atlanta, GA - As a firm believer in the power of a smart factory, Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is a session speaker and Platinum Sponsor at the upcoming eSMART Factory Conference on 22 and 29 September 2021 in Coventry, United Kingdom. The first day is an in-person event with a focus on advanced automation systems, which concludes with a tour of the fully integrated CFX production line at the MTC. That CFX line includes the Koh Young 8030 solder paste inspection (SPI) and Zenith automated optical inspection (AOI) systems, which were the very first inspection systems to achieve the challenging IPC Qualified Product List (QPL) certification. The second day is a virtual event focusing on Industry 4.0, supply chain, and next-generation materials. This annual event brings together leading technologists and engineers who will present, discuss, and debate the future of Industry 4.0 technologies. Register today at esmartfactory.net.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
