Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
Technical Library | 2013-02-07 17:01:46.0
Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2021-11-17 18:53:50.0
The demand for product miniaturization, especially in the handheld device area, continues to challenge the board assembly industry. The desire to incorporate more functionality while making the product smaller continues to push board design to its limit. It is not uncommon to find boards with castle-like components right next to miniature components. This type of board poses a special challenge to the board assemblers as it requires a wide range of paste volume to satisfy both small and large components. One way to address the printing challenge is to use creative stencil design to meet the solder paste requirement for both large and small components. ... The most important attribute of a stencil is its release characteristic. In other words, how well the paste releases from the aperture. The paste release, in turn, depends on the surface characteristics of the aperture wall and stencil foil. The recent introduction of new technology, nano-coating for both stencil and squeegee blades, has drawn the attention of many researchers. As the name implies, nano-coated stencils and blades are made by a conventional method such as laser-cut or electroformed then coated with nano-functional material to alter the surface characteristics. This study will evaluate nano-coated stencils for passive component printing, including 01005.
Industry News | 2009-12-07 18:47:04.0
November, 2009 - EVS International, the world leader in solder recovery System’s, announces the launch of a brand new interactive website aimed at Explaining to the industry the enormous cost and environmental benefits from automating the solder dross recovery element of the wave soldering process.
Industry News | 2018-07-03 04:09:30.0
Solder migration or Squeeze Out can be seen when solder reflows on packages which are underfilled and is feature on the NPL Defect Database and shows you what is happening
Industry News | 2015-10-13 14:07:18.0
Goepel is pleased to announce their latest webinar, "3D Circumference Inspection for Connector Insertion - Quality Control of Plug-in Contacts using 3D Measurement Method" on Tuesday, October 27th.
Industry News | 2021-10-07 15:38:24.0
Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."
Industry News | 2013-04-04 13:53:58.0
Seika Machinery, Inc., announces that it has added a video demonstration of the Sayaka SAM-CT23W Twin-Table PCB Router to Seika TV. The latest video can be viewed at http://www.seikausa.com/tv/sayaka-sam-ct25w-twin-table-router.
Industry News | 2009-01-30 19:00:08.0
The University of Maryland Center for Advanced Life Cycle Engineering (CALCE) is pleased to announce that it will host a workshop on the testing of lead-free soldered assemblies. The primary goal of the workshop is to provide a forum of technical exchange regarding experiences, lessons learned, data, and other information on testing of lead-free electronic assemblies.
Industry News | 2014-03-13 11:57:36.0
What does it take to make it to 80 years in an industry where today's technology is obsolete tomorrow? For Indium Corporation, it takes foresight and dedication.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
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