Industry News | 2017-11-17 15:22:12.0
Altus will be demonstrating new technology and concepts for future state electronic manufacturing when the company attends the ‘Road to Digital Factory of the Future: Electronic Manufacturing’ later this month.
Industry News | 2005-08-22 18:40:30.0
Indium Corporation�s Vice President of Technology, Dr. Ning-Cheng Lee, is featured on the cover of Electronics Manufacturing CHINA (EM China), the leading Chinese technical publication for the electronics manufacturing industry in China.
Industry News | 2004-03-02 09:52:56.0
Valor-Denmark immediately poised to deliver field-proven MES solutions
Industry News | 2021-10-31 21:32:05.0
At present and in the future, the maintenance of the electrical control equipment, VFD (Variable Frequency Drive) will become the professional knowledge that all electricians need to master. As a reliable supplier of leading brands of VFDs for many years, OKmarts now shares ten simple and easy maintenance methods to the majority of VFD maintenance technicians. Hopefully these experience can help you in the maintenance of VFDs.
Industry News | 2021-12-06 20:13:05.0
At present and in the future, the maintenance of the electrical control equipment, VFD (Variable Frequency Drive) will become the professional knowledge that all electricians need to master. As a reliable supplier of leading brands of VFDs for many years, OKmarts now shares ten simple and easy maintenance methods to the majority of VFD maintenance technicians. Hopefully these experience can help you in the maintenance of VFDs.
Industry News | 2010-09-27 23:01:06.0
Christopher Associates/Koki Solder announces that Jasbir Bath will present a paper titled “An Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Component Manufacturing Applications” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
Technical Library | 2013-02-07 17:01:46.0
Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2021-11-17 18:53:50.0
The demand for product miniaturization, especially in the handheld device area, continues to challenge the board assembly industry. The desire to incorporate more functionality while making the product smaller continues to push board design to its limit. It is not uncommon to find boards with castle-like components right next to miniature components. This type of board poses a special challenge to the board assemblers as it requires a wide range of paste volume to satisfy both small and large components. One way to address the printing challenge is to use creative stencil design to meet the solder paste requirement for both large and small components. ... The most important attribute of a stencil is its release characteristic. In other words, how well the paste releases from the aperture. The paste release, in turn, depends on the surface characteristics of the aperture wall and stencil foil. The recent introduction of new technology, nano-coating for both stencil and squeegee blades, has drawn the attention of many researchers. As the name implies, nano-coated stencils and blades are made by a conventional method such as laser-cut or electroformed then coated with nano-functional material to alter the surface characteristics. This study will evaluate nano-coated stencils for passive component printing, including 01005.
Industry News | 2009-12-07 18:47:04.0
November, 2009 - EVS International, the world leader in solder recovery System’s, announces the launch of a brand new interactive website aimed at Explaining to the industry the enormous cost and environmental benefits from automating the solder dross recovery element of the wave soldering process.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
