Industry News | 2018-02-27 20:18:09.0
Cogiscan Inc.announces that it has been awarded a 2018 NPI Award in the category of Software – Process Control for its Factory Intelligence – Analytics. The award was presented to the company during a Tuesday, Feb. 27, 2018 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2019-08-29 21:58:20.0
PACE Worldwide and Cumberland Electronics have teamed up to host two separate Technical Workshops on "Non-Destructive BGA/Area Array Component Rework" on September 10th at ACI Technologies in Philadelphia PA, and on September 12th at the PACENTER Training Center in Elkridge MD.
Industry News | 2021-04-08 04:36:23.0
BTU International, Inc. received a 2021 CIRCUITS ASSEMBLY NPI Award in the category of Soldering – Alternative for its Health Check Service. The award was announced during a special online awards ceremony on Tuesday, April 6, 2021.
Industry News | 2024-03-26 12:57:14.0
CalcuQuote and Cetec ERP are pleased to announce that their collaboration has been recognized with a 2024 CIRCUITS ASSEMBLY NPI Award. The companies' integrated software solution, aptly named "Supply Chain Connected ERP," was awarded in the Software – Management category. The Supply Chain Connected ERP integration, developed by these industry-leading companies, represents a significant advancement in electronics manufacturing and supply chain management.
Industry News | 2024-06-17 12:20:15.0
PEMTRON is excited to announce its participation in SEMICON West, the premier event for the semiconductor manufacturing industry. Taking place from July 9-11, 2024 at the Moscone Center in San Francisco, California, PEMTRON will discuss its innovative inspection systems at #booth 865.
Industry News | 2017-04-13 06:06:32.0
Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on 2.30pm UK time go to https://www.bobwillis.co.uk/events/ Benchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratoy. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry
Industry News | 2012-02-23 15:41:59.0
Following a year of successful product launches, MYDATA continues its drive to accelerate the success of electronics manufacturers worldwide. At the IPC APEX Expo show (Booth #3429) the company will show visitors how to Agilify their production with faster, smarter and more agile assembly solutions. Highlights include the new High Speed Synergy line rated at 90,000 cph, a highly advanced solution that enables any assembly environment to handle both prototyping and volume production - all within a single production line.
Industry News | 2012-02-23 16:13:22.0
As electronic assemblers struggle to cope with increasingly complex packages and board designs, MYDATA reports a surge of interest in its jet printing technology. Software-controlled and stencil free, the technology is now used in 25 countries and hundreds of plants worldwide. In 2011, MYDATA’s system sales increased by 47 percent - a record year representing gains in market share for its entire SMT product line, including a strong growth for jet printing equipment.
Career Center | Bolingbrook, Illinois USA | Production,Technical Support
We are a global solutions provider that designs, manufactures, markets and services optical networking, next-generation switching and broadband access solutions. Tellabs products are used worldwide by communications services providers. The word abo
Career Center | San Diego (Mira Mesa), California USA | Engineering
SMT MANUFACTURING (Quality) ENGINEER (Process Engineer) Duties & Responsibilities: Researches, develops and installs SMT processes and equipment necessary to produce high quality, least cost products. Responsible for the identification and elim
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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