Industry News | 2010-04-23 21:50:38.0
BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® has released verified attendance figures from IPC APEX EXPO™, held April 6–9, 2010, in Las Vegas, indicating a 10 percent increase over last year with 3,702 attendees.
Industry News | 2011-10-08 17:53:09.0
Heralding two exhibit floors at its new home in the San Diego Convention Center, one of which is already completely sold out, IPC APEX EXPO® and its 2012 exhibitors are relishing in the sunshine of the show’s move to San Diego, February 28-March 1, 2012.
Industry News | 2018-02-05 21:08:33.0
When the IPC APEX EXPO show floor opens on Tuesday, February 27, more than 20 equipment vendors, software providers and customers from across the electronics industry will participate in an IPC Connected Factory Exchange (CFX) Showcase. The IPC CFX Showcase -- a technological demonstration operating in real time -- will deliver standardized machine data from participating exhibitors through the cloud and onto visitors’ mobile phones.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Technical Library | 2017-04-20 13:51:14.0
The one constant in electronics manufacturing is change. Moore's Law, which successfully predicted a rate of change at which transistor counts doubled on Integrated Circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool. Increasing technical and economic requirements, deriving from the semiconductor environment, are cascaded down to the printed circuit and in particular to the IC substrate manufacturers. This is both a challenge and an opportunity for IC Substrate manufacturers, when dealing with the demands of the packaging market. (...)This paper introduces two new electroless copper baths developed for IC substrates manufacturing based on Semi Additive Process (SAP) technology (hereafter referred to as E'less Copper IC) and HDI production (hereafter referred to as E'less Copper HDI) and optimized for high throw into BMVs. An introduction to reliable throwing power measurement methods based on scanning electron microscope (SEM) is given, followed by a compilation and discussion of key performance criteria for each application, namely throwing power, copper adhesion on the substrate, dry film adhesion and reliability.
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