Industry Directory | Consultant / Service Provider
Oracle Corporation is an American multinational computer technology corporation specializing primarily in developing and marketing database software and technology, cloud engineered systems, and enterprise software products.
Reverse Logistics Services - new product inventory pool management, including warehousing, shipping and receiving, round-trip processing, CTO, refurbishment, EOL, ordering, tracking, metrics reporting, and SAP and Oracle interface.
Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
New Equipment | Surface Finish
The Oracle is the smallest and most flexible full production cluster system on the market. The system consists of a central vacuum transport (CVT), vacuum cassette elevators and up to four process reactors. These process reactors are docked to the ce
Electronics Forum | Fri Jun 10 14:54:25 EDT 2011 | dimation55337
Greetings Everyone, We have lost our copy of the Soldapro Oracle for Multicore's Soldapro Thermal Profile System Model TPS 001. This is not the Slimline model. We have a Slimline, and it's software package (v2.9, dll v1.23) is not compatible with t
Electronics Forum | Fri Jun 10 14:59:34 EDT 2011 | dimation55337
Greetings Everyone, We have lost our copy of the Soldapro Oracle for Multicore's Soldapro Thermal Profile System Model TPS 001. This is not the Slimline model. We have a Slimline, and it's software package (v2.9, dll v1.23) is not compatible with t
Used SMT Equipment | Conveyors
Asys AD Oracle Exhaust System for DMC Leadframe Marker wanted. Please email me with details.
Used SMT Equipment | Semiconductor & Solar
Laser Fume Extraction System
Industry News | 2010-04-10 02:37:34.0
IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO™, held April 6–8, 2010 in Las Vegas.
Industry News | 2011-04-20 21:19:17.0
IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Technical Library | 2016-03-24 17:37:09.0
Today's Electronic Industry is changing at a high pace. The root causes are manifold. So world population is growing up to eight billions and gives new challenges in terms of urbanization, mobility and connectivity. Consequently, there will raise up a lot of new business models for the electronic industry. Connectivity will take a large influence on our lives. Concepts like Industry 4.0, internet of things, M2M communication, smart homes or communication in or to cars are growing up. All these applications are based on the same demanding requirement – a high amount of data and increased data transfer rate. These arguments bring up large challenges to the Printed Circuit Board (PCB) design and manufacturing.This paper investigates the impact of different PCB manufacturing technologies and their relation to their high frequency behavior. In the course of the paper a brief overview of PCB manufacturing capabilities is be presented. Moreover, signal losses in terms of frequency, design, manufacturing processes, and substrate materials are investigated. The aim of this paper is, to develop a concept to use materials in combination with optimized PCB manufacturing processes, which allows a significant reduction of losses and increased signal quality.
Technical Library | 2019-02-20 16:35:24.0
The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments, including chemical bonding and newer low etch alternative oxides) applied just prior to press lamination. Initial high frequency Dk/Df electrical test results did not show a strong correlation with any of the methods utilized within this project to measured surface roughness. The more significant factor affecting the measured loss is the choice of pre-lamination surface treatment. Most of the new chemical treatment systems outperform the older existing systems which depend upon surface roughness techniques to promote adhesion.
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
Career Center | Charlotte, North Carolina USA | Accounting/Finance
Financial Analyst � Accounts Receivable Will serve as the user administrator of Oracle AR. Will be responsible for testing new functionality and application upgrades, maintaining bills to customer, transaction types and invoice types. Assist in es
Career Center | Fremont, California USA | Quality Control
Must know how to operate AOI & AXI equipment to inspect. Must be able to correctly review and dispose AXI rejects. To perform visual inspection of solder joints quality per IPC 610 workmanship standards and component value and polarity identi
Career Center | vestal, New York USA | Quality Control
Over 7 years of experience as lead quality engineer in the filed of SMT. Extensive knowledge on Universal GSM,GC60 and GC120 Machines. worked on IBM Rational and Mercury Winruner testing tools.
Career Center | Obour, Egypt | Engineering,Maintenance,Production
Ten years of experience in electronics assembly work for Toshiba Egypt and Iskraemeco Egypt • Researched, analyzed and selected production equipment. • Work within team to startup Iskraemeco’s new factory in Egypt. • L
SMTnet Express, March 24, 2016, Subscribers: 24,113, Companies: 14,735, Users: 39,910 High Frequency DK and DF Test Methods Comparison High Density Packaging User Group (HDP) Project Karl Sauter; Oracle Corporation, Joe Smetana; Alcatel
