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Capital Expo & Tech Forum

Events Calendar | Thu Mar 07 00:00:00 EST 2024 - Thu Mar 07 00:00:00 EST 2024 | Manassas,

Capital Expo & Tech Forum

Surface Mount Technology Association (SMTA)

IPC Conference Targets Critical Issues for the Military Market

Industry News | 2011-10-12 22:07:12.0

Changes in export regulations, transforming military technology trends, and impending defense budget cuts are just three of a host of factors that are altering the business and technology landscapes of the defense market - and all with significant impacts on the electronics manufacturing industry.

Association Connecting Electronics Industries (IPC)

Dr. Michio Kaku Chosen to Keynote IPC APEX EXPO 2013 “Rock Star” Physicist Wins Popular Vote by IPC Members

Industry News | 2012-08-27 16:14:13.0

Theoretical physicist, best-selling author and futurist Dr. Michio Kaku has been selected through a vote of IPC members to be the IPC APEX EXPO® 2013

Association Connecting Electronics Industries (IPC)

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2017 Deadline for technical conference paper abstracts extended to: July 8, 2016

Industry News | 2016-07-02 06:45:13.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017. The extended deadline is July 8, 2016.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2021

Industry News | 2020-03-08 16:23:52.0

IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23-28, and the technical conference will take place January 26-28, 2021.

Association Connecting Electronics Industries (IPC)

Orbotech Discovery II 8800

Used SMT Equipment | AOI / Automated Optical Inspection

Selling Orbotech AOI. Model: Discovery II 8800 Vintage:2015 Please contact for more details. Best Rgards, Christie ************* global@mc-biz.net

Global BizTeK Co.,

Orbotech Receives Major Multi-Million Dollar Order for LDI and AOI Systems from Endicott Interconnect Technologies- Manufacturer Now Largest User of LDI Technology in the Americas

Industry News | 2007-05-30 17:19:09.0

Billerica, MA � May 24, 2007. Orbotech, Inc., the North American subsidiary of Orbotech Ltd., today announced jointly with Endicott Interconnect Technologies, Inc. (EI) that the advanced electronic interconnect supplier has placed a major multi-million dollar order for Orbotech laser direct imaging (LDI) and automated optical inspection (AOI) equipment for use in production at its facility in Endicott, NY, USA.

i3 Electronics

HEI, Inc. Invests in Advanced PCB Production Capabilities to Support Expansion

Industry News | 2012-04-09 13:27:45.0

HEI and Orbotech announced that HEI has taken delivery of and qualified the Paragon™ 9800 Laser Direct Imaging (LDI) system, Ultra Discovery™ Automated Optical Inspection (AOI) system as well as InPlan®Flex and GenFlex® CAM/Engineering software.

HEI Inc.

Orbotech Receives Major Order from Leading Taiwanese LCD-TFT Manufacturer

Industry News | 2003-07-03 08:37:48.0

AU Optronics Orders 10 Additional Orbotech AOI Systems for 5th Generation LCD Production

Orbotech

Orbotech’s SPTS Technologies Accelerates Industry Adoption of its Mosaic Plasma Dicing Solution with Order from JCAP Corporation

Industry News | 2017-03-08 19:49:16.0

ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Mosaic Plasma Dicing System from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies. Orbotech's SPTS also announced that a recent analysis of MEMS microphones in the iPhone 7 Plus conducted by System Plus Consulting[1] confirmed that an ASIC device in the iPhone 7 Plus had been plasma diced.

Orbotech


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