Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Sat Mar 15 09:30:29 EDT 2008 | davef
Unlike other solderability protection, immersion coatings [eg, ImAg, ImSn, OSP, etc] can be reworked by the board fabricator prior to assembly operations. Reasons for selecting immersion are: * Until a supplier can demonstrate that they can turn bla
Electronics Forum | Thu Jul 20 17:01:26 EDT 2000 | Bob Willis
Here is some further information on SDSRS process, but please purchase a copy of the report from t he SMTA as all the money goes to charity. In the UK the SMART Group raised over �3000 for the homeless. SMTA have been raising a lot of money for the G
Electronics Forum | Thu Jul 20 15:08:53 EDT 2000 | Bob Willis
Yes no problem here it is in a nut shell. The sponsor of my CD ROM on this process was Loctite who specifically developed a glue for the process to cure in less than 10seconds. Have a word with these guys they may even have a few CDs. PROCESS SEQUEN
Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef
Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr
Electronics Forum | Thu Jun 14 13:41:06 EDT 2001 | bentzen
Thanks a lot Dave. I think I will stay away from OSP. I just thought that it could be a cheaper solution than NiAU for fine pitch. And I don�t trust the silver coating types. Brian
Electronics Forum | Fri Jun 18 17:18:27 EDT 1999 | Jason Gregory
| | | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave
Electronics Forum | Fri Jun 18 17:19:48 EDT 1999 | Jason Gregory
| | | | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rav
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Wed Dec 06 09:09:54 EST 2017 | davef
Suppliers have improved the utility and quality of OSP [organic solderability preservative] solderable surface protection over the years. Be cautious reading too much into older SMTnet [and web in general] conversations about handling OSP. When prop
