Electronics Forum | Thu Apr 05 08:36:35 EDT 2001 | jmlasserre
use a solder join temperature of 200/210� whatever the pcb used (tin lead coated or osp or gold fash). 2nd ==> to adapt the temerature to the pcb used: - Reflow (200-210�) for tin lead coated pcb's (in this case we have just to reflow the solder
Electronics Forum | Fri Jun 27 10:27:59 EDT 2003 | davef
Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.3
Electronics Forum | Sun May 02 16:57:09 EDT 2004 | davef
You're correct. We prefer to probe solder, rather than copper, because the solder absorbs the impact of the probe better than copper and so, helps preserve the life of the probe. Beyond that, OSP has a limited "shelf life". If the OSP is not coate
Electronics Forum | Mon Jan 28 07:30:21 EST 2002 | cnotebaert
Is it just certain locations on the board, or is it random, does it occur on every board, does this happen on any other products you have been running? If this occurs only on the 1 board and in random locations I wouldn�t say its your wave setup. I
Electronics Forum | Sat Sep 08 08:55:24 EDT 2007 | davef
We expect to see a copper shadow along the edge of pads when soldering boards with organic solderability protection [OSP]. IPC-A-610 has defined this as acceptable for years. During early reflow stages, the flux in paste dissolves the OSP where ther
Electronics Forum | Wed Jun 10 17:18:47 EDT 1998 | Igmar Grewar
| Okay, here's a stupid question. What exactly is HASL and OSP? We are going to delve into this technology where I work and I want to utilize the wealth of knowledge here to make life easier. Specifically, what are the differences, the advantages, di
Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren
We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the
Electronics Forum | Wed Sep 07 16:53:15 EDT 2005 | GS
Contact Cookson Electronic, they can support you with OSP solutions (ENTEK---) new formulations for Lead Free apllication. Regards GS --------- from a 2003 Cookson presentation: Objective Although Existing ENTEK� PLUS CU106A technology is suc
Electronics Forum | Fri Aug 15 09:48:10 EDT 2003 | davef
First, what do you mean by "mishandled OSP" boards? Second, we don't like to bake our OSP boards, because of the potential to degrade the coating. Why do you want to bake these boards? Third, why not paste-up a board, reflow it, and assess the sol
Electronics Forum | Fri Sep 24 09:48:28 EDT 1999 | Shane
I am developing a DOE for evaluating SMT adhesives. I would like to evaluate 3 different vendor dispensing adhesives. I currently have the Heraeus PD955M and the Loctite 3609 and 3618 selected for evaluation. I would like to add another manufactur
