EzPCB offers various kinds of surface finishing technology, including Sn/Pb, Ni/Au, immersion gold, chemical silver etc. Lead-free OSP finishing technology is our newly introduced service, and is welcomed by customers in the EU, US and in Austrilia.
New Equipment | Industrial Automation
TDC3000 SYSTERM CARDS 51304516-200,51305348-100,51304584-100,51401583-100, 51304362-150,51309152-100,51304485-100,51304441-100, 51402615-400,51401583-100,51196654-100,51402089-100, 51304685-150,51304511-100,51304511-200,51304754-150, 51304337-15
Electronics Forum | Wed Jan 21 16:55:22 EST 2004 | patrickbruneel
Hi, Are you testing bare boards or soldered boards. Are the test probes in contact with soldered pads or contacting the copper with the osp coating (not soldered). If you could clarify this it would be easier to give some hints for probable causes.
Electronics Forum | Wed Jan 21 17:43:04 EST 2004 | Kris
Hi, I had the same question. In our case we are contacting the copper with the osp coating (not soldered). any published reports that we can reference Thanks
Industry News | 2011-05-16 16:53:28.0
SMTA China announces that it presented eight overall awards, nine best paper/presentation awards and two best exhibit awards at the SMTA China East 2011 Conference Award Presentation Ceremony, held on Thursday, May 12, 2011 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Fifth Anniversary Gala dinner.
Industry News | 2010-04-11 02:21:50.0
GREELEY, CO — FCT Assembly announces that it has been awarded an NPI Award in the category of Flux for its NC160 lead-free flux. The award was presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.
Technical Library | 2021-07-06 21:18:02.0
A new PCB surface finish has been developed that offers outstanding performance and excellent environmental protection. This finish has the potential to replace more common finishes such as ENIG, ImAg, ImSn, ENEPIG, or OSP with a chemically resistant plasma deposited coating. The substitution of the wet processes with this dry plasma process offers significant advantages e.g. lower quantities of chemicals used, environmental benefits and improved operator safety.
Technical Library | 1999-08-09 11:09:42.0
Organic Solderability Preservatives (OSPs), also known as anti-tarnish, on bare copper printed circuit boards (PCBs) are becoming more prevalent in the electronics industry as the low-cost replacement to Hot Air Solder Leveling (HASL). Introducing the anti-tarnish alternative into the customer sites requires working closely with the coating supplier, assembler, and Original Equipment Manufacturer (OEM) to gain a mutual understanding of respective processing concerns and finished product requirements.
******Contact|Mac****** Sales manager: Mac Xie Mobile: +8618020714662(Whatsapp) Email: at@mooreplc.com Skype: +8618020714662 ******Contact|Mac****** Quick Details CC-PAIN01 | Analog Input Module | Honeywell Features : S
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. The substrate is the primary component and serves as the PCB’s skeleton, providing its core strength. The copper layer is a copper foil or coating that conducts electrical signals throughout the PCB
| http://www.thebranfordgroup.com/dnn3/Auction/TSLE0523.aspx
. Sn - Osp manual electroplating w/post-cleaning + dryer Laif Cu & Tn Pattern Plate Electroplating Line PVA Tepla Plasma-Etch System Hot Air Levelling Laif HASL Pre-Clean Line Cemco Quicksilver Hot Air Leveller lead free Pola e Massa HASL post-cleaning Artwork
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