New Equipment | Solder Materials
KappZapp3.5R Rosin-cored Solder is a convenient solder for most Copper, Brass and Stainless Steel plumbing and sheet applications. The center of the solder contains a Rosin flux. When the solder is heated, the flux is released and removes the oxide c
New Equipment | Solder Materials
KappZapp7R Rosin-cored Solder has rapidly become the audio industry standard for electrical / electronic Copper applications. The 7% Silver solder creates extremely clean conductive joints with high strength, ductility and corrosion resistance. The c
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New Equipment | Education/Training
The Atmospheric Pressure Plasma (AP Plasma) designed by professional engineers in an eco-friendly environment to completely remove any kind of organic pollutants. Application Academic and Industrial Research Laboratory Photoelectric eleme
Hybrid Laser Marking Integrating technology of YVO4 laser and fiber laser; Excellent model of high quality and high power; High Quality, High Power Built-in camera to realize AF; No stop when products changed;
The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent
Industry News | 2009-05-18 17:19:51.0
GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.
Industry News | 2009-05-20 19:17:30.0
GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Industry News | 2008-01-23 10:23:28.0
Milton, NY � January 17, 2008 � Sono-Tek Corporation, the world leader in the development and application of ultrasonic atomization technology and spraying and coating application systems, announces that it will highlight the MediCoat DES 1000 benchtop stent coating system and the MediCoat II standalone stent coating system in booth 1472 at the upcoming Medical Design & Manufacturing (MD&M) West exhibition and conference scheduled to take place January 29-31, 2008 at the Anaheim Convention Center in Anaheim, CA.
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