Industry Directory | Manufacturer
PCB manufacturer. 2, 4, 6, 8 layers PCB. HASL, ENIG, OSP.
Industry Directory | Manufacturer
PCB maker in Penang. 2-14 layers PCB. HASL, ENIG, OSP. ImmAg. george.lim@elnapcb.com
New Equipment | Fabrication Services
XPCB Limited is one of the leading flexible PCB suppliers in China. We fabricate and assemble the most complex flexible circuit boards for harsh applications, including Oil&Gas, Medical, Security, and Aircraft & Satellite. Layer supported: 1-12 laye
Project Description | Parameters 4 Layer Thickness: 1.2+/-0.12 mm Min Hole Size: 0.3 mm Width/Space: 0.12mm/0.12 mm Surface Treatment: ENIG | Craft Red Ink ENIG+OSP | Application Consumer Electronics
Industry News | 2013-08-07 09:58:46.0
The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
Technical Library | 2023-01-06 16:18:23.0
PCB/Substrate Finishing Overview - iNEMI - PCB Surface Finish Overview. Surface Finish deployment ranked by surface area. OSP greatest. Imm Tin. ENIG. Silver. ENEPIG.
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
Events Calendar | Mon Apr 12 18:30:00 UTC 2021 - Mon Apr 12 18:30:00 UTC 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Mon Apr 12 18:30:00 UTC 2021 - Mon Apr 12 18:30:00 UTC 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
| https://pcbasupplies.com/wp-content/uploads/2023/10/S3X58-M650-7-solder-paste.pdf
. Comparison of pin testability Resistance between Probe and PCB Ease of residue pin testing delivers high inspection accuracy S3X58-M650-7 完全ハロゲンフリーソルダペースト Sn 3.0Ag 0.5Cu Sn 3.0Ag
